Fuji Electric Co., Ltd.
6-2
MT6M12343 Rev.1.0
Dec.-2016
Chapter 6
Mounting Guideline and Thermal Design
Soldering
(1)
The device temperature during soldering might exceed the maximum storage temperature. To
prevent damage to the device and to ensure reliability, please use the following soldering
temperature.
(2)
The immersion depth of the lead terminal should be more than 1.5mm apart from the device. When
using flow-soldering, be careful to avoid immersing the package in the solder bath.
(3)
It is not recommended to reuse the device after it is removed from the circuit board. There is a
possibility that the removed device was subjected to thermal or mechanical damage during the
removal process.
Methods
Soldering Temp. & Time
Note
a
Solder dipping / Soldering iron
260
±
5
℃
, 10
±
1sec
b
Solder dipping / Soldering iron
350
±
10
℃
，
3.5
±
0.5sec
Table 6.1 Soldering temperature and duration
1. Soldering to PCB
