Zeiss DirectFRAP, Operating Manual

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Notes on Instrument Safety
DirectFRAP Safety Instructions Carl Zeiss
05/2014 423635-9001-701 7
1.2 Safety Instructions
1.2.1 Notes on Laser Radiation
The DirectFRAP imaging system is a class 3B laser system and labeled accordingly (total output
power on the microscope: max. 500 mW). If you use laser instruments, adhere to the provisions
concerning health protection and industrial safety. Users should also ensure that they observe
all relevant legal requirements.
If operated correctly, the DirectFRAP imaging system does not create any risk of radiation exposure for
operating personnel. Nevertheless, you should observe the following warnings:
Inform the laser safety officer before you begin with procedures for initial start-up of the
DirectFRAP imaging system.
•
The system is equipped with a safety key switch.
•
Always keep the key for the laser key switch and, where applicable, the keys for any other
laser starter switches in places which are not accessible to persons who are not authorized to
handle the laser.
•
Do not expose yourself to the laser beam!
•
Do not place any reflecting objects into the beam path!
•
Never open any covers on the microscope system while the laser is in operation!
•
Never look into the laser beam, either with or without optical instrument. Nor should you do
so if you just want to view the specimen.
Non-observance involves the risk of eye
damage!
•
Cover all currently not used objective nosepiece mounts and camera ports with the dust-
protective caps provided!
•
Take suitable precautions if the laser radiation produces noxious gases, dust and vapors,
secondary radiation or explosive substances on the specimen.
Observe the additional national laser protection requirements!
Keep combustible and highly flammable materials away from the laser beam.