Zynq-7000 AP SoC and 7 Series FPGAs MIS v4.1
42
UG586 November 30, 2016
Chapter 1:
DDR3 and DDR2 SDRAM Memory Interface Solution
•
I/O Power Reduction
– This option reduces the average I/O power by disabling DQ
and DQS IBUFs automatically whenever the controller is in the idle state.
•
XADC Instantiation
– When enabled, this option directs MIG core to instantiate the
XADC and a temperature polling circuit for the Temperature Monitor feature (see
). This option can be disabled if the XADC is already used
elsewhere in the design. In this case, the device temperature must be periodically
sampled and driven onto the
device_temp_i
bus in the memory interface top-level
user design module. If the
device_temp_i
signal is left unconnected, then the XADC
is instantiated. Otherwise the XADC is not instantiated.
Click
Next
to display the
DCI Description
page (
).
•
Digitally Controlled Impedance (DCI)
– The DCI option allows the use of the FPGA
on-chip internal resistors for termination. DCI must be used for DQ and DQS/DQS#
signals. DCI cascade might have to be used, depending on the pinout and bank
selection. DCI is available in the High Performance Banks.
•
Internal Termination for High Range Banks
– The internal termination option can be
set to 40, 50, or 60
Ω
or disabled. This selection is only for High Range banks.
X-Ref Target - Figure 1-23
Figure 1-23:
DCI Description
UG586_c1_29_090511