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VCU118 Board User Guide
31
UG1224 (v1.0) December 15, 2016
Chapter 3:
Board Component Descriptions
RLD3 Component Memory
[
, callout 5]
The 288 MB RLD3 72-bit wide component memory system is comprised of two 36-bit 1.125
Gb RLDRAM3 devices (Micron MT44K32M36RB-083E) located at U141-U142. This memory
system is connected to the XCVU9P HP banks 46, 47, and 48. The RLD3 0.6V VTT termination
voltage (net RLD3_C3_VTT) is sourced from TI TPS51200DR linear regulator U143. The RLD3
memory interface bank VREF pins are not connected, which, coupled with an XDC
set_property INTERNAL_VREF constraint, invoke the INTERNAL VREF mode. The
connections between the RLD3 component memories and XCVU9P banks 46, 47, and 48 are
listed in
Table 3-4:
RLD3 Memory 72-bit I/F to FPGA U1 Banks 46, 47, and 48
FPGA
(U1) Pin
Schematic Net Name
I/O Standard
Component Memory
Pin #
Pin Name
Ref. Des.
H39
RLD3_C3_72B_DQ0
SSTL12
D11
DQ0
U141
H40
RLD3_C3_72B_DQ1
SSTL12
E10
DQ1
U141
G40
RLD3_C3_72B_DQ2
SSTL12
C8
DQ2
U141
F40
RLD3_C3_72B_DQ3
SSTL12
C10
DQ3
U141
H38
RLD3_C3_72B_DQ4
SSTL12
C12
DQ4
U141
G38
RLD3_C3_72B_DQ5
SSTL12
B9
DQ5
U141
K37
RLD3_C3_72B_DQ6
SSTL12
B11
DQ6
U141
J37
RLD3_C3_72B_DQ7
SSTL12
A8
DQ7
U141
F38
RLD3_C3_72B_DQ8
SSTL12
A10
DQ8
U141
J35
RLD3_C3_72B_DQ9
SSTL12
J10
DQ9
U141
H35
RLD3_C3_72B_DQ10
SSTL12
K11
DQ10
U141
J36
RLD3_C3_72B_DQ11
SSTL12
K13
DQ11
U141
H37
RLD3_C3_72B_DQ12
SSTL12
L8
DQ12
U141
H34
RLD3_C3_72B_DQ13
SSTL12
L10
DQ13
U141
G35
RLD3_C3_72B_DQ14
SSTL12
L12
DQ14
U141
F35
RLD3_C3_72B_DQ15
SSTL12
M9
DQ15
U141
F36
RLD3_C3_72B_DQ16
SSTL12
M11
DQ16
U141
G36
RLD3_C3_72B_DQ17
SSTL12
N8
DQ17
U141
E37
RLD3_C3_72B_DQ18
SSTL12
D3
DQ18
U141
E38
RLD3_C3_72B_DQ19
SSTL12
E4
DQ19
U141
C39
RLD3_C3_72B_DQ20
SSTL12
C6
DQ20
U141
B40
RLD3_C3_72B_DQ21
SSTL12
C4
DQ21
U141
A39
RLD3_C3_72B_DQ22
SSTL12
C2
DQ22
U141