JODY-W2 - System integration manual
UBX-18068879 - R14
Handling and soldering
Page 59 of 84
C1 - Public
Reflow soldering process
JODY-W2 series modules are surface mounted devices supplied in a Land Grid Array (LGA) package
with gold-plated solder lands. The modules are manufactured in a lead-free process with lead-free
soldering paste.
The thickness of solder resist between the top side of the host PCB and the bottom side of the JODY-
W2 series module must be considered for the soldering process.
JODY-W2 modules are compatible with the industrial reflow profile for common SAC type RoHS
solders. No-clean soldering paste is strongly recommended. The reflow profile is dependent on the
thermal mass over the entire area of the fully populated host PCB, the heat transfer efficiency of the
oven, and the type of solder paste that is used. The optimal soldering profile that is used must be
trimmed for each case depending on the specific soldering process and PCB layout.
The target parameter values shown in
are only general guidelines for a Pb-free process. The
given values are tentative and subject to change. For further information, see also the JEDEC
J-STD-020E standard
Process parameter
Unit
Target
Pre-heat
Ramp up rate to
T
SMIN
K/s
3
T
SMIN
°C
150
T
SMAX
°C
200
t
S
(from 25°C)
s
150
t
S
(Pre-heat)
s
110
Peak
T
L
°C
217
t
L
(time above
T
L
)
s
90
T
P
(absolute max)
°C
260
t
P
(time above
T
P
-5°C)
s
30
Cooling
Ramp-down from
T
L
K/s
6
General
T
to peak
s
300
Allowed soldering cycles
-
1
Table 30: Recommended reflow profile
Figure 15: Reflow profile
☞
A lower value of T
P
and slower ramp down rate (2
–
3 °C/sec) is preferred.
