JODY-W2 - System integration manual
UBX-18068879 - R14
Handling and soldering
Page 60 of 84
C1 - Public
Cleaning
Cleaning the modules is not recommended. Residues underneath the modules cannot be easily
removed with a washing process.
•
Cleaning with water will lead to capillary effects where water is absorbed in the gap between the
baseboard and the module. The combination of residues of soldering flux and encapsulated water
leads to short circuits or resistor-like interconnections between neighboring pins. Water will also
damage the sticker and the ink-jet printed text.
•
Cleaning with alcohol or other organic solvents can result in soldering flux residues flooding into
the housing, areas that are not accessible for post-wash inspections. The solvent will also damage
the sticker and the ink-jet printed text.
•
Ultrasonic cleaning will permanently damage the module and the crystal oscillators in particular.
•
For best results use a "no clean" soldering paste and eliminate the cleaning step after the soldering
process.
Other notes
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Only a single reflow soldering process is allowed for boards with a module populated on them.
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Boards with combined through-hole technology (THT) components and surface-mount technology
(SMT) devices may require wave soldering to solder the THT components. Only a single wave
soldering process is allowed for boards populated with the modules.
•
Miniature Wave Selective Solder process is preferred over traditional wave soldering process.
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Hand soldering is not recommended.
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Rework is not recommended.
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Conformal coating may affect the performance of the module, it is important to prevent the liquid
from flowing into the module. The RF shields do not provide protection for the module from coating
liquids with low viscosity, so care is needed when the coating is applied. Conformal coating of the
module will void the warranty.
•
Grounding metal covers: Attempts to improve grounding by soldering ground cables, wick, or other
forms of metal strips directly onto the EMI covers is done at the customer's own risk and will void
the module warranty. The numerous ground pins are adequate to provide optimal immunity to
interferences.
•
The modules contain components that are sensitive to Ultrasonic Waves. Use of any ultrasonic
processes, like cleaning and welding, might damage the module. Use of ultrasonic processes on
an end product integrating this module will void the warranty.
