V02.00 | 2019/10
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6.2.2
Shielding of the fieldbus and I/O level
The fieldbus and I/O module level of the TBEN-L modules can be grounded separately.
1
2
3
Fig. 10: Grounding clip (1), grounding ring (2) and metal screw (3)
The grounding ring (2) provides the grounding for the module. The shielding of the I/O level is
permanently connected to the module ground. Only by mounting the module is the module
ground connected to the reference potential of the installation.
Grounding concept of the I/O modules (I/O level)
When mounted directly on a mounting plate, the module is connected to the reference poten-
tial of the installation via a metal screw (3) in the lower mounting hole. If no module grounding
is required, the electrical connection to the reference potential is interrupted, e.g. with a plastic
screw.
Grounding concept of the fieldbus level
The device is factory shipped with a grounding clip provided on the connectors for the fieldbus
connection.
When mounted directly on a mounting plate the shielding of the fieldbus cables is routed dir-
ectly to the
module ground via the grounding clip and the metal screw in the lower mounting hole.
If direct grounding of the fieldbus shield is not required, the grounding clip must be removed.
In this case, the fieldbus shield is connected to the module ground via an RC element.
6.2.3
Grounding the device – I/O level and fieldbus level
The ground of the fieldbus level can either be connected directly and routed via the grounding
clip (1) or indirectly via an RC element with the ground of the I/O level. If the fieldbus connec-
tion is to be routed via an RC element, the grounding clip must be removed.
1
2
3
Fig. 11: Grounding clip (1)
