Verdin Carrier Board Design Guide
Preliminary
– Subject to Change
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Page | 96
Figure 89: Maximum Component Height with a 5.2 mm SODIMM Connector
Even though a SODIMM with 5.2 mm height provides a nominal board-to-board distance of 2.62
mm it is not recommended to place any components underneath the module (except for those that
are next to the edge connector). The clip mechanism of the SODIMM connector is not rigid. This
means that upon inserting the module, the module can be pushed a bit further down in the
direction of the carrier board. Together with the additional tolerances of the connector and the
module PCB thickness, there is no space left for components on the carrier board.
Even if a module does not use up all the component height allowance, it is advisable not to
squeeze in further components between the module and the carrier board. Reserving the complete
component height to the module guarantees mechanical compatibility with existing and future
Verdin modules and module versions. If components need to be placed underneath the module, a
connector with a larger stacking height is recommended.
4.2
Fixation of the Module
The SODIMM DDR4 connector comes with an integrated clip mechanism for a fast, secure, and
convenient fixation of the module. For a lot of applications, this fixation is enough. However, if the
module is used in a harsh environment were higher vibration and shock tolerance/resistance is
required, the module can be screwed down to the carrier board. Screwing down the module is also
advisable if heavier heatsinks are mounted directly to the module. There are two mounting holes
at the edge of the module which are designed to be used with M2 screws.
The spacers on Toradex carrier boards to be used with Verdin modules are only 2 mm tall which
allows for an easier insertion and a better mounting experience. However, for a final product, it is
recommended to use 2.5 mm spacers, especially if a heatsink is also mounted with those spacers.
This provides a less convenient mounting experience but makes sure the module is mounted
perfectly parallel to the carrier board.
4.3
Thermal Solution
TBA
Board to Board Distance min. 2.00
max. 3.00
1.20
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18
.00
max. 0.80
22
.00
Carrier Board PCB
Module PCB
No Components allowed
on Carrier Board
Components with maximum 0.8mm height allowed
on Carrier Board
Carrier Board
Components
61.60
