Verdin Carrier Board Design Guide
Preliminary
– Subject to Change
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Potential Issues Caused by Backfeeding
................................................................ 82
.................................................................................. 83
....................................................................................... 86
Mechanical and Thermal Consideration
........................................................................ 95
Module Connector and Stacking Height
........................................................................... 95
Connector and Standoff Land Pattern Requirements
......................................................... 97
Carrier Board Space Requirements
................................................................................. 98
– Module Top Side Signal Definition
.......................................................... 99
– Module Bottom Side Signal Definition
................................................... 103
Appendix C - Physical Pin Definition and Location
..................................................... 107