Texas Instruments BQ25157, Manual

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8 Specifications
8.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN MAX UNIT
Voltage
IN –0.3 20 V
TS, ADCIN, VDD, NC –0.3 1.95 V
VINLS, PMID -0.3 6.2 V
All other pins –0.3 5.5 V
Current
IN 0 800 mA
BAT, PMID –0.5 1.5 A
INT, ADCIN, PG 0 10 mA
Junction temperature, T
J
–40 125 °C
Storage temperature, T
stg
–55 150 °C
(1) Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under
Recommended Operating Condition . Exposure to absolute-maximum-rated conditions for extended periods may affect device
reliability.
8.2 ESD Ratings
VALUE UNIT
V
(ESD)
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/
JEDEC JS-001, all pins
(1)
±2000
V
Charged device model (CDM), per JEDEC
specification JESD22-C101, all pins
(2)
±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
8.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
V
BAT
Battery voltage range 2.4 4.6 V
V
IN
Input voltage range 3.15
6.05
(1)
V
V
INLS
LDO input voltage range 2.2 6.05
(1)
V
V
IO
IO supply voltage range 1.2 3.6 V
V
ADCIN
ADC input voltage range 0 1.2 V
I
LDO
LDO output current 0 100 mA
I
PMID
PMID output current 0 1.5 A
T
A
Operating free-air temperature range –40 85 °C
(1) Based on minimum V
OVP
value. 6.2V under typical conditions
8.4 Thermal Information
THERMAL METRIC
(1)
BQ25157
UNIT YFP (DSBGA)
20-PIN
R
θJA
Junction-to-ambient thermal resistance
(2)
36.1 °C/W
R
θJA
Junction-to-ambient thermal resistance 74.4 °C/W
R
θJC(top)
Junction-to-case (top) thermal resistance 0.5 °C/W
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BQ25157
SLUSEC5 – DECEMBER 2020
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