xE922-3GR Hardware User Guide
1VV0301272
Rev.0.8 2017-01-05
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Page 69 of 112
Recommended routing guidelines for the whole MIPI-CSI-2 signal traject :
parameter
guideline
Characteristic impedance (stripline / microstrip)
100 ohm differential 10%(SL) 15%(MS)
Trace spacing : between differential pairs or between
differential pair and other signals (h = dielectric height)
5xh (SL) 7xh (MS)
Total length
(add-on pcb (L1)+ carrier (L2)+ (module (L3+L4))
Min. 45.7 mm / Max. 203.2 mm (MS/SL)
Max. number of vias allowed
2 through-hole vias + 3 microvias + 2
connector pins
Length matching between P and N within a differential pair
Within same layer mismatch: +/-0.254 mm
Total length mismatch: +/-0.381 mm
Length matching between DATA to CLK
Within same layer mismatch : +/- 1.27 mm
Total length mismatch: +/- 2.54 mm
Guidelines for off-module sub trajects:
parameter
Addon board
Carrier board
Transmission line segment L1
L2
Length [mm]
12.7
–
63.5 (MS)
12.7
–
88.9 (MS/SL)
Actual xE922-3GR module signal trace (L3+L4) implementation:
signal name
module trace length [mm]
Number of microvias
on the module
CSI1_CLKN
9.99
2
CSI1_CLKP
9.79
2
CSI1_DN0
10.97
2
CSI1_DP0
11.22
2
CSI1_DN1
7.26
2