Technical Information
Chapter
4
TiM3xx
Electrical installation
8014318/YK97/2015-04-27
© SICK AG · Germany · All rights reserved · Subject to change without notice
21
4.3
Notes on electrical installation
Prerequisites for enclosure rating IP 65:
The black rubber plate (USB socket) must be flush-mounted on the housing.
The TiM3xx should be protected from moisture and dust when the cover of the USB
socket is open.
Electrical connections between the TiM3xx and other devices may only be connected
or disconnected when the system is not live, otherwise the devices may be damaged.
Conducting cross sections of the supply cable from the customer's power system
should be selected and perform in accordance with the applicable standards.
If the voltage for the TiM310-1130000/TiM320-1031000 is not supplied via the
optional CDB730-001 connection module (part no. 1055981), the TiM3xx should be
protected with an external 0.8 A delay-action fuse at the start of the supply cable from
the point of view of the power supply. The connection module already has a suitable
fuse.
All electrical circuits connected to the TiM3xx must be designed as SELV or PELV elec-
tric circuits (SELV =
S
afety
E
xtra
L
ow
V
oltage, PELV =
P
rotective
E
xtra
L
ow
V
oltage).
Do not switch on the supply voltage for the TiM3xx until the connection work has been
completed and wiring work has been checked carefully.
4.4
Prerequisites for safe operation of the TiM3xx in a system
The TiM3xx is designed and tested for electrical safety according to the standard EN 60950-
1 (2006-04)/A11 (2009-03):
It is connected to peripheral devices (power supply, control, actuators) via shielded cables.
The cable shield e.g. of the supply line is therefore flush with the metal housing of the
TiM3xx. The device can either be grounded via the cable shield or via the two straight plates.
If the peripheral devices also have metal housing and if the cable shields also flush with
their housing, it is assumed that all devices involved in installation have the
same ground
potential
.
This is achieved by observing the following conditions for instance:
mounting of devices on conducting metal surfaces
professional grounding of devices/metal surfaces in the system
low-impedance and current-conducting equipotential bonding between areas with dif-
ferent ground potentials if necessary.
If these conditions are not met, e.g. on devices in a widely distributed system across several
buildings, equipotential bonding currents may, due to different ground potentials, flow via
the cable shields between the devices, which can lead to dangers.
