© SAMSUNG Electronics Co., Ltd.
18
(Continued)
Part No.
Location
Quantity
Part Name
Specification
2203-000206
BC11, BC21, BC31
3
C-CER, CHIP 100 NF, 10 %, 50 V, X7R, 2012
2203-000206
BC12, BC22, BC32
3
C-CER, CHIP 100 NF, 10 %, 50 V, X7R, 2012
2203-000206 BC151,
BC251,
BC351
3
C-CER, CHIP 100 NF, 10 %, 50 V, X7R, 2012
2203-000206 BC152,
BC252,
BC352
3
C-CER, CHIP 100 NF, 10 %, 50 V, X7R, 2012
2203-000206
BC51-BC56
6
C-CER, CHIP 100 NF, 10 %, 50 V, X7R, 2012
2203-000206
C111, C211, C311
3
C-CER, CHIP 100 NF, 10 %, 50 V, X7R, 2012
2203-000206
C152, C252, C352
3
C-CER, CHIP 100 NF, 10 %, 50 V, X7R, 2012
2203-000206
C153, C253, C353
3
C-CER, CHIP 100 NF, 10 %, 50 V, X7R, 2012
2203-000206
C51-C54
4
C-CER, CHIP 100 NF, 10 %, 50 V, X7R, 2012
2203-000239
C61-C67
7
C-CER, CHIP 0.1 NF, 5 %, 50 V, C0G, TP, 2012
2203-000408
C159, C259, C359
3
C-CER, CHIP 0.18 NF, 5 %, 50 V, C0G, TP, 2012
2203-000595
C157, C257, C357
3
C-CER, CHIP 0.22 NF, 5 %, 50 V, C0G, TP, 2012
2203-000938
C160, C260, C360
3
C-CER, CHIP 0.47 NF, 5 %, 50 V, C0G, TP, 2012
2203-001058
C156, C256, C356
3
C-CER, CHIP 0.56 NF, 5 %, 50 V, C0G, TP, 2012
2203-001132
C158, C258, C358
3
C-CER, CHIP 0.68 NF, 5 %, 50 V, NP0, TP, 2012
2203-001391
C151, C251, C351
3
C-CER, CHIP 150 NF, 10 %, 25 V, X7R, TP, 2012
2305-001054
C101, C201, C301
3
C-FILM,
LEAD-PEF
820 NF, 10 %, 250 V, TP, 18 × 7.5 × 13.5,
2401-003298
C104, C204, C304
3
C-AL
100 uF, 20 %, 63 V, GP, TP, 8 × 11.5, 5
2402-000170
C11, C12, C31
3
C-AL, SMD
1 uF, 20 %, 50 V, GP, TP, 4.3 × 4.3 × 5.4
2402-000170
C161, C261, C361
3
C-AL, SMD
1 uF, 20 %, 50 V, GP, TP, 4.3 × 4.3 × 5.4
2402-001033
C98, C99
2
C-AL, SMD
220 uF, 20 %, 16 V, GP, TP, 8.3 × 8.3 × 10
2402-001034
C105, C205, C305
3
C-AL, SMD
22 UF, 20 %, 35 V, GP, TP, 6.6 × 6.6 × 5.4
2402-001042
C57, C58
2
C-AL, SMD
100 uF, 20 %, 16 V, GP, TP,
6.6 × 6.6 × 5.4 mm
2703-000202 L1
1
INDUCTOR-
SMD
33 uH, 10 %, 3225
3301-000344 B51,
B52
2
BEAD-
RADIAL
200 ohm, 3.5 × 0.6 × 6.5 mm, 7000 mA, TP
3501-001035 K101,
K201,
K301
3
RELAY-
MINIATURE
5VDC, 140 MW, 2000 MA, 2FORMC,
4 MS, 4 MS
3501-001035 K103,
K203,
K303
3
RELAY-
MINIATURE
5VDC, 140 MW, 2000 MA, 2FORMC,
4 MS, 4 MS
3501-001035 K202
1
RELAY-
MINIATURE
5VDC, 140 MW, 2000 MA, 2FORMC,
4 MS, 4 MS
3703-000176 P1
1
CONNECTOR
-BACK PANEL
50 P, 2R, FEMALE, STRAIGHT, AUF
3704-001001
P101, P201, P301
3
SOCKET-IC
8 P, SIP, SN, 2.54 mm
Summary of Contents for OfficeServ 12
Page 1: ...GANA 000029 Ed 001 OfficeServ 12 Service Manual ...
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Page 104: ... SAMSUNG Electronics Co Ltd 32 This page is intentionally left blank ...
Page 106: ... SAMSUNG Electronics Co Ltd 2 A 1 2 Solder Side ...
Page 107: ... SAMSUNG Electronics Co Ltd 3 A 2 3 4TRK Board A 2 1 Component Side ...
Page 108: ... SAMSUNG Electronics Co Ltd 4 A 2 2 Solder Side ...
Page 109: ... SAMSUNG Electronics Co Ltd 5 A 3 2BRI Board A 3 1 Component Side ...
Page 110: ... SAMSUNG Electronics Co Ltd 6 A 3 2 Solder Side ...
Page 111: ... SAMSUNG Electronics Co Ltd 7 A 4 MGI Board A 4 1 Component Side A 4 2 Solder Side ...
Page 112: ... SAMSUNG Electronics Co Ltd 8 This page is intentionally left blank ...