Samsung OfficeServ 12 Service Manual Download Page 99

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(Continued)

Part No.

Location

Quantity

Part Name

Specification

2203-000206

C51-C54

C-CER, CHIP

100 NF, 10 %, 50 V, X7R, 2012

2203-000239

C61-C67

C-CER, CHIP

0.1 NF, 5 %, 50 V, C0G, TP, 2012

2203-000408

C159, C259, C359,

C459

C-CER, CHIP

0.18 NF, 5 %, 50 V, C0G, TP, 2012

2203-000595

C157, C257, C357,

C457

C-CER, CHIP

0.22 NF, 5 %, 50 V, C0G, TP, 2012

2203-000938

C160, C260, C360,

C460

C-CER, CHIP

0.47 NF, 5 %, 50 V, C0G, TP, 2012

2203-001058

C156, C256, C356,

C456

C-CER, CHIP

0.56 NF, 5 %, 50 V, C0G, TP, 2012

2203-001132

C158, C258, C358,

C458

C-CER, CHIP

0.68 NF, 5 %, 50 V, NP0, TP, 2012

2203-001391

C151, C251, C351,

C451

C-CER, CHIP

150 NF, 10 %, 25 V, X7R, TP, 2012

2305-001054

C101, C201, C301,

C401

4 C-FILM,

LEAD-PEF

820 NF, 10 %, 250 V, TP, 18x7.5x13.5,

2401-003298

C104, C204, C304,

C404

C-AL

100 uF, 20 %, 63 V, GP, TP, 8x11.5, 5

2402-000170

C11, C12, C31, C32

C-AL, SMD

1 uF, 20 %, 50 V, GP, TP, 4.3x4.3x5.4,

2402-000170

C161, C261, C361,

C461

C-AL, SMD

1 uF, 20 %, 50 V, GP, TP, 4.3x4.3x5.4,

2402-001033

C98, C99

C-AL, SMD

220 uF, 20 %, 16 V, GP, TP, 8.3x8.3x10

2402-001034

C105, C205, C305,

C405

C-AL, SMD

22 UF, 20 %, 35 V, GP, TP, 6.6X6.6X5.4

2402-001042

C57, C58

C-AL, SMD

100 uF, 20 %, 16 V, GP, TP, 6.6x6.6x5.4 mm

2703-000202 L1

INDUCTOR-

SMD

33 uH, 10 %, 3225

3301-000344 B51,

B52

BEAD-RADIAL 200 ohm, 3.5x0.6x6.5 mm, 7000 mA,

3501-001035

K101, K201, K301,

K401

4 RELAY-

MINIATURE

5 VDC, 140 MW, 2000 MA, 2FORMC,

4 MS, 4 MS

3501-001035

K103, K203, K303,

K403

4 RELAY-

MINIATURE

5 VDC, 140 MW, 2000 MA, 2FORMC,

4 MS, 4 MS

3501-001035 K202,

K302

RELAY-

MINIATURE

5 VDC, 140 MW, 2000 MA, 2FORMC,

4 MS, 4 MS

3703-000176 P1

CONNECTOR-

BACK PANEL

50P, 2R, FEMALE, STRAIGHT, AUF

3704-001001

P101, P201, P301,

P401

SOCKET-IC

8P, SIP, SN, 2.54 mm

3722-000250 P2,

JACK-

MODULAR

6P/6C, INVERTED, N, ANGLE,

STANDARD

4715-000127

V101, V201, V301,

V401

4 SURGE

ABSORBER

300 V, 15%, 500 A

Summary of Contents for OfficeServ 12

Page 1: ...GANA 000029 Ed 001 OfficeServ 12 Service Manual ...

Page 2: ... trademark of SAMSUNG Electronics Co Ltd Product names mentioned in this document may be trademarks and or registered trademarks of their respective companies This manual should be read and used as a guideline for properly installing and operating the product This manual may be changed for the system improvement standardization and other technical reasons without prior notice If you need updated m...

Page 3: ...Document Center 2nd Floor IT Center Dong Suwon P O Box 105 416 Maetan 3dong Yeongtong gu Suwon si Gyeonggi do Korea 442 600 Homepage http www samsungdocs com 2004 SAMSUNG Electronics Co Ltd All rights reserved ...

Page 4: ...ER 2 Disassembly and Reassembly This chapter describes how to disassemble the OfficeServ 12 system CHAPTER 3 Troubleshooting This chapter describes problems that may occur while using the OfficeServ 12 system and the solutions to such problems CHAPTER 4 H W Block Diagrams and Schematic Description This chapter describes the hardware block diagrams and provides a schematic description of the Office...

Page 5: ...or fatality CAUTION Provides information or instructions that the reader should follow in order to avoid a service failure or damage to the system CHECKPOINT Provides the operator with checkpoints for stable system operation NOTE Indicates additional information as a reference Reference OfficeServ 12 Intallation Guide This guide is an installer s guide containing information on system specificatio...

Page 6: ...ion the following information must be given to the operator user and shall be read before the installation and operation Symbols Caution Indication of a general caution Restriction Indication for prohibiting an action for a product Instruction Indication for commanding a specifically required action ...

Page 7: ... for cleaning Do not spray directly on the unit and do not clean the unit with benzene thinner or alcohol to prevent fire and electric shock Do not wire the system during a lightning storm This is to prevent electric shocks caused by lightning Do not directly connect the external paging equipment or a common bell to a commercial AC power supply This is to prevent fire and immediate breakdown of th...

Page 8: ...ower during program upgrades Follow the instructions below before disassembling the OfficeServ 12 system Unplug the AC power cable and turn off the OfficeServ 12 system power Remove the cables of external devices such as phone and external battery from the OfficeServ 12 system Wear wrist straps and ground the straps before handling boards or parts of the OfficeServ 12 system ...

Page 9: ...to the hole first and then insert the screw into the bushing This is to prevent the system from falling and breaking Do not install the system places subject to moisture or wetness Do not install the system near a bathtub wash bowl kitchen sink and laundry tub in a damp basement or near a swimming pool Doing so may cause a malfunction or shorten the life span of parts Do not disassemble repair or ...

Page 10: ...1 Hardware Descriptions 1 1 1 1 Front View 1 1 1 2 Ports and Switch After Removing Side Cover 2 1 1 3 Bottom View 3 1 2 Specifications 4 1 2 1 CPU Memory Switch 4 1 2 2 System Capacity 4 1 2 3 Power Specifications 5 1 2 4 Environment Specifications 5 1 2 5 Cable Specifications 5 1 2 6 Dimensions 5 1 2 7 Others 5 CHAPTER 2 Disassembly and Reassembly 1 2 1 Boards and PSU 1 2 1 1 When 3 4TRK is Equip...

Page 11: ...W Block Diagram 1 4 2 Schematic Description 2 4 2 1 Power Supply Unit 2 4 2 2 Base board 4 4 2 3 3 4TRK 2BRI Board 19 4 2 4 MGI Board 22 4 2 5 Ring Generator 23 CHAPTER 5 Exploded View and Parts List 1 5 1 Exploded View 1 5 2 Parts List 2 5 2 1 Base Board 2 5 2 2 3TRK Board MPD Type With CID 12 5 2 3 3TRK Board PRS Type With CID 16 5 2 4 4TRK Board MPD Type Without CID 19 5 2 5 4TRK Board PRS Type...

Page 12: ...d IX A 2 3 4TRK Board 3 A 2 1 Component Side 3 A 2 2 Solder Side 4 A 3 2BRI Board 5 A 3 1 Component Side 5 A 3 2 Solder Side 6 A 4 MGI Board 7 A 4 1 Component Side 7 A 4 2 Solder Side 7 ABBREVIATION I A D I F M II N S III T W IV ...

Page 13: ... 9 Figure 4 7 Reset Circuit Block Diagram 10 Figure 4 8 DLI Port Wiring Diagram 15 Figure 4 9 Hybrid Port Wiring Diagram 16 Figure 4 10 SLI Port Wiring Diagram 16 Figure 4 11 Music Source Paging Dry Contact Wiring Diagram 17 Figure 4 12 Battery Backup 18 Figure 4 13 Analog Trunk Board 3 4TRK 19 Figure 4 14 2BRI Block Diagram 21 Figure 4 15 MGI Block Diagram 22 Figure 5 1 Exploded View of OfficeSer...

Page 14: ... country 1 1 Hardware Descriptions This section introduces each view and part descriptions of the OfficeServ 12 system 1 1 1 Front View Figure 1 1 Front View of the OfficeServ 12 Table 1 1 Front Side Cover Item Description Front Cover The front cover must be removed to view the boards or internal cables of the system or to disassemble the system Side Cover The side cover must be removed to view th...

Page 15: ...hen power is interrupted to keep data for a predetermined time The switch must be turned ON after the data is input DLI1 port DLI1 Digital Line Interface 1 port is for connecting a digital phone exclusively used for the OfficeServ 12 system to which the phone is interlocked HYB1 HYB2 port HYB1 Hybrid1 HYB2 Hybrid2 ports are for connecting a digital phone or analog phone SLI1 SLI5 port SLI Single L...

Page 16: ... ground connection cable A groove for grounding Power switch A switch for turning On Off the AC power Power connector A port for connecting the power adaptor plug Groove for wall mounting A groove for wall mounting LAN port A port for connecting a hub or AP Groove for ground connection cable Power connector Power switch Groove for wall mounting LAN port ...

Page 17: ...4 Analog trunk lines with Caller ID Trunk 2BRI 2 Digital trunk lines 4 channels CO3 BRI2 line 2 Channels can be substituted for ISDN station lines Station 8 lines 1 line for digital phone 2 hybrid and 5 lines for analog phones Music on hold Background music channel 1 internal or external General purpose dry contact 1 External Page 1 AP for WLAN 1 WIP 5000M phone 4 The OfficeServ 12 system provides...

Page 18: ...cations Table 1 8 Cable Specifications Item Specification Digital Phone 2 line cable maximum 400 m 1300 Ft AWG 24 Analog Phone 2 line cable maximum 1 km 3000 Ft AWG 24 DPIM 2 line cable maximum 300 m 1000 Ft AWG 24 Door Phone 2 line cable maximum 100 m 330 Ft AWG 24 LAN RJ 45 1 2 6 Dimensions Table 1 9 Dimensions Item Height mm Width mm Depth mm Mass kg OfficeServ 12 190 350 60 2 0 DPIM 29 90 120 ...

Page 19: ... SAMSUNG Electronics Co Ltd 6 This page is intentionally left blank ...

Page 20: ... in reverse order 2 1 Boards and PSU OfficeServ 12 is composed of the base board 3 4TRK board 2BRI board MGI Media Gateway Interface board and PSU Power Supply Unit 2 1 1 When 3 4TRK is Equipped The following figure shows the board configuration of OfficeServ 12 when the 3 4TRK analog trunk daughter board is equipped on the base board Figure 2 1 OfficeServ 12 Board Configuration When 3 4TRK is Equ...

Page 21: ...1 2 When 2BRI is Equipped The following figure shows the board configuration of OfficeServ 12 when the 2BRI digital trunk daughter board is equipped on the base board Figure 2 2 OfficeServ 12 Board Configuration When 2BRI is Equipped ...

Page 22: ... Disassemble the OfficeServ 12 system as following procedure Follow the instructions below before disassembling the OfficeServ 12 system Unplug the AC power plug from the wall outlet and turn the OfficeServ 12 system power switch off Remove the cables of external devices such as phone and external battery from the OfficeServ 12 system 1 Remove the side cover by slightly pushing and pulling the upp...

Page 23: ... SAMSUNG Electronics Co Ltd 4 2 Remove the two screws at the side of the system 3 Remove the two screws at the bottom panel of the system ...

Page 24: ... SAMSUNG Electronics Co Ltd 5 4 Remove the top cover 5 Remove the two screws marked below in order to separate the 3 4TRK board or 2BRI board ...

Page 25: ...om the base board Follow the instructions below before disassembling the OfficeServ 12 system Wear wrist straps and ground the straps before handling boards or parts of the OfficeServ 12 system 7 Remove the MGI board attached to the connectors on both ends of the base board ...

Page 26: ...G Electronics Co Ltd 7 8 Remove the screw marked below to separate the base board from the system chassis Remove the cable from the PSU Power Supply Unit 9 Remove the 4 screws marked below to separate the PSU ...

Page 27: ... SAMSUNG Electronics Co Ltd 8 10 The system chassis should be emptied as shown below when all boards and PSU are removed ...

Page 28: ...OfficeServ 12 SAMSUNG Electronics Co Ltd 1 Troubleshooting This chapter describes problems that may occur while using the OfficeServ 12 system and solutions for solving those problems ...

Page 29: ...tage between 51 V and 57 V measured Pull out the Power cable connected to base board Measured the DC Voltage between GND and 55 V of CN21 within the power board Check battery Fuse F21 within the power board Is 55 V normal Check the Fuse F22 within the power board No No Yes Replace the power board Is F22 normal No Yes A A Yes No Replace the Fuse F22 F22 125 V 2A Turn on Power Check 5 V normal Measu...

Page 30: ...oor battery backup as follows Is the value above 50 V No Check the voltage of battery Is the value under 45 V The system will not work if battery is Connected without AC power Usable without any restrictions Yes Yes No END Analyze system battery ...

Page 31: ...oting Checking the base board boot as follows Replace the base board Check if various boards are properly installed on the Base board Check if Boot ROM V121 is properly installed on the base board No Yes Check if LED1 on base board is blinking fast download After download check if LED1 is blinking normally END Yes No Turn on the Power switch ...

Page 32: ...3 of SLIC 795552QC END No Yes Is higher than 40 V Trace 55 V from P992 and repair the fault Yes Are they higher than 40 V Check if the voltage of 26 27 Is higher than 50 V Check the relay e g K501 fitter e g M501 Wattage resister R504 R505 Repair the fault Replace the SLIC Subscriber Line Interface Circuit No Check the voltage of the tip and ring END ...

Page 33: ...k if tone signals are outputted to pin17 15 of SLIC 795552QC Is tone outputted Check if time slot signal Is inputted from pin25 of the QSLAC LE58Q021 VC Is the time slot signal inputted Are signals inputted from the HWR Replace the QSLAC Quad low voltage Subscriber Line Audio processing Circuit LE58Q021 VC Replace the base board Yes Yes Yes Yes No Check if the level of pin10 DET of SLIC 795552QC I...

Page 34: ...ected Troubleshooting 3 Follow the troubleshooting procedure of the When No Tone is sent to the SLI port failure This failure does not occur when the When No Tone is sent to the SLI port problem is solved Failure 4 When the ring does not go off Troubleshooting 4 ...

Page 35: ...the PC851 TLP181 Is Ring signal outputted Check if Ring singnal is outputted from the negative pin of D861 Is Ring singal outputted Replace the Relay of the corresponding port Is 80 VDC outputted at both ends of C877 Replace PWM Pulse Width Modulation IC U853 Replace Q851 Replace Q852 Q855 Yes No Yes No Replace the Relay Yes Can you hear the Relay sound No Check the Relay sound END ...

Page 36: ...d to the DLI port Troubleshooting 1 Replace the Transformer DCT 1 of the corresponding port Yes Replace the polyswitch Is polyswitch normal Replace the keyset No Are they higher than 40 V Check the polyswitch of the corresponding port No Yes Check the voltage of the tip and ring END ...

Page 37: ... When DLI port does not work Troubleshooting 2 Replace the engine STC9604 No Replace U381 Are signals normal Check if the keyset display VER xxx Check 4M pin9 FSX pin11 CLKX pin10 of the QDASL U381 Check OCCLK pin19 CI pin21 CO pin20 Yes END ...

Page 38: ...Replace the Base board Yes Are signals normal Check if signals 2M FSX DCLK HVO of the QSLAC U452 Yes Check if the 8 th SLI port is normal Is music signal supply to the QSLAC U452 Scope the C423 input of the QSLAC U452 Yes Change the shunt pin No Is the shunt pin normal Check if the shunt pin p421 is located at INT position Yes Yes No Does the music signal supply to the QSLAC U452 Replace the Music...

Page 39: ...he shunt pin to EXT position No Replace base board Yes Is connection normal Check if MOH source is connected to pin 3 4 of the P973 Is the shunt pin normal Yes Refer to When internal MOH BGM is not working No Check if the shunt pin p421 is located at EXT position Is internal MOH normal Check if internal MOH is working Yes END ...

Page 40: ...n normal Yes Refer to When internal MOH BGM is not working No Check if speaker is connected to pin1 6 of the p973 Is internal MOH normal Check if internal MOH is working Yes Operate the transistor Q401 and check the status No Does relay sound Replace the transistor Q401 input resistor R402 and diode D401 No Is the transistor normally functioning Yes Check if 5V is supplied to the relay pin1 Replac...

Page 41: ...eive Troubleshooting END No Check CPLD Complex Programmable Logic Device U51 version No Are signals normal Yes Are MMCs normal Check if the MMCs are set normally Yes Check if the signals of the U151 are normal 8 M pin32 INT_8MS pin64 HAS pin13 MRW pin129 MRD pin127 CS_DSP 17 Replace LV51 Repair MMC ...

Page 42: ...ooting No Are the patterns normal Yes Replace U931 Replace the base board No Is the clock normal Check the crystal signal 25 MHz pin27 pin28 of the U931 Check 25 MHz output signal pin78 of the U931 Yes Check the patterns from U931 to RJ 45 P901 Replace crystal Y931 Repair abnormal signals END ...

Page 43: ...he Relay is running by sound during trunk seizure Replace the TMC Replace 3 4TRK board Is the Relay control signal normal No Yes Is the voltage between the TIP and RING higher than 30V Replace TMC Trunk Module Controller U51 Replace the Relay Yes Request to repair the trunk line Is the Relay normally operating Yes No No Yes END Check if the absolute voltage between the TIP and the RING is higher t...

Page 44: ...ting 2 No Is HOS Hook Off Sensing output Yes Replace TMC U51 No Is the ring supplying voltage higher than 40 Vrms Check if ring supplying voltages at the TIP and RING are higher than 40 Vrms Yes Request to repair the trunk line Check the ring path Consisting of two Zener diodes END ...

Page 45: ...hile transmission is possible Are Rx signals supplied Check signals of HWX Pin 11 of the CODEC and BCLKX Pin 9 10 of the CODEC Are both transission and Reception impossible Is there any problem in Pin 3 Tx Check Tx and Rx signals from Pin 3 and Pin 14 of the corresponding CODEC Check Pin 9 10 BCLKX Pin 5 12 FS Pin 6 HWR and Pin 11 HWX of the CODEC Yes Yes Yes Yes Yes No No Yes No No No OK No Call ...

Page 46: ... 1 When the 2BRI is not recognized Troubleshooting 1 No Is CPLD version normal Yes Replace 2BRI board No Are the signals normal Check the data bus of the board and the board enabling signals Yes Repair the faulty port Reprogram CPLD Check CPLD U1 version END ...

Page 47: ...C Frame Synchronize OSC Oscillator No Repair the address data bus Is the bus normal Yes OK No Are the signals normal Yes Check the address Data bus signals No Is clock 7 68 MHz normal Check if the 7 68 MHz clock normally are supplied to pin35 U151 U251 Yes Check the clock path Replace the OSC Y301 Check if FSC pin 52 4M pin 53 DU pin 50 DD pin 51 are normally supplied to the ISAC Check the CPLD U1...

Page 48: ...lectronics Co Ltd 21 3 10 MGI Failures Failure When No MGI call is connected Troubleshooting No Is the MGI board installed Check if the MGI board is installed Yes Install MGI board Check if the MMC SET normal END ...

Page 49: ...Diagram OfficeServ 12 Hardware block diagram is as follows Figure 4 1 H W Block Diagram 5 V 56 V Battery Connection Port Power Supply Unit Input AC 220 V Output 56 V 5 V External Battery 50 pin Connector Digital Trunk Daughter Board 2BRI 40 pin Connector VoIP Daughter Board MGI Analog Trunk Daughter Board 3 4TRK 1 DLI 2 HYB 5 SLI 2 LAN MEMORY BACKUP 1 INT EXT MOH 1 PAGE 1 DRY CONTACT RINGER Base b...

Page 50: ...d for system control and digital power External battery control and interface required for operating the system during a power failure The power supply system of OfficeServ 12 is illustrated below Figure 4 2 Power Supply System Line Filter Main DC Switching Power Circuitry Smoothing Circuit Feedback Circuitry 5VDC Switching Power Circuitry Smoothing Circuit Feedback Circuitry 55 VDC 0 5 A GND F1 H...

Page 51: ...ddition to supplying power such as 55 VDC and 5 VDC the PSU provides an external battery interface An external battery is used when AC power is not supplied to the system for reasons such as power failure or an emergency situation Under normal circumstances the external battery is charged using the DC power of the system Upon power failure or an emergency the battery supplies the main DC power to ...

Page 52: ...m Flash ROM NAND Boot ROM DSP TMS320LC548 MGI AC48204 RS232C SRAM SRAM RESET MPC 855T Buffer RTC QDASL QSLAC1 CPLD M4A3 192 96 Backup QSLAC1 SLIC 1 SLIC 2 SLIC 3 SLIC 4 SLIC 5 SLIC 6 SLIC 7 Bridge Dry Contact MISC DLI SLI1 SLI2 SLI3 SLI4 SLI5 HYB1 HYB2 TRANS TRANS TRANS 3 4TRK 2BRI D B d STC9604 5 V Regulation Ringer Square Wave Paging Music Connector ...

Page 53: ...ctions of the CPU are as follows Embedded MPC8xx core z 4 Kbyte data cache and 4 Kbyte instruction cache z MMUs z Advanced on chip emulation debug mode Up to 32 bit data bus dynamic bus sizing for 8 16 and 32 bits 32 address lines Memory controller eight banks z Four 16 bit timers or two 32 bit timers SIU System Integration Unit Seven external IRQ Interrupt request lines Four baud rate generators ...

Page 54: ... the change and maintains the command execution status until the TA signal returns to normal status OfficeServ 12 uses DTACK signals generated from the engine DSP Digital Signal Processor MGI and 2BRI boards Figure 4 4 TA DTACK Signal Control CPU MPC 855T Interrupt The CPU MPC 855T has an eight level interrupt architecture The priority of each level is determined by the level entering the IPL0 IPL...

Page 55: ...gine STC9604 contains a T switch composed of eight highways and each highway consists of 32 channels Thus the engine can control a total of 256 channels 256x256 The T switch is the core of a digital PABX and is the most important part of the engine Each switch controls gain through 8 steps Since OfficeServ 12 is a small system only four out of the eight highways are used HW0 Highway used by the 8S...

Page 56: ...eight groups which are referred to as highways Each highway operates independently and contains 32 voice channels Digital Conference The engine was designed to support 5 way 6 group conference but OfficeServ 12 currently supports only 5 way 5 group conference CPLD CS7 MRW DTACK CS_9604 R W DTA_9604 A4 A23 D00 D07 LA8 LA27 LD00 LD07 MPC855 STC9604 Buffer ...

Page 57: ...nals received through a trunk line or an intercom line The DTMF decoder usually decodes DTMF signals received from common phones and trunk lines The former function is used more frequently When the key phone system performs the DISA function the DTMF decoder often receives and processes DTMF signals from trunk lines Each engine has four decoders which means that the system can process 4 channels a...

Page 58: ...of the engine 4 2 2 3 Reset Composed of various circuits the system may malfunction due to internal or external reasons Thus a reset circuit is required to protect sensitive components such as the CPU from electric shock and to protect the system from logical traps Reset circuits were originally used for protecting the CPU but are now used for all components that require protection A WD Watch Dog ...

Page 59: ...ch as SRAM SDRAM NAND flash memory and boot ROM SRAM This SRAM Static Random Access Memory working memory must be backed up by battery Characteristics of SRAM are as follows Device SAMSUNG K6F8016U6A EF70 Memory Capacity 1 MByte 512 K x 16 x 2 Quantity 2 Power 3 3 V Bus Bandwidth 16 bits Interfaces with CPU through 32 bit bus Retention Voltage Min 1 5 V SRAM is used for DB data storage SRAM has a ...

Page 60: ...also support 16 bit interface Device SAMSUNG K9F2808U0C YCB0 Memory Capacity 16 Mbyte Quantity 1 Socket Not Used Package 48P TSOP Bus Bandwidth 8 bits 16 bits will be enabled in the future Power 3 3 V Boot ROM Boot ROM Read Only Memory stores booting program and DB data Device AMD Am29LV040B 120JC Memory Capacity 512 KByte Quantity 1 Socket Not used Package 32P PLCC Bus Bandwidth 8 bits Boot ROM p...

Page 61: ...te HPI High speed Portable Internet Interface Quantity 1 Power 3 3 V Package 144P TQFP Thin Quad Flat Package Bus Width 8 Bits DSP is used for Caller ID Tx Rx A 8 Bit HPI bus is used for interfacing with the host TMS32LC549 HD00 07 HRDY HRD HWR HR W HB_IL MR W HCNTLO HCNTL1 HCS HCS MPC855T D24 31 DTACK OE WEO LA31 LA30 LA29 LA28 CS4 LA08 LA09 LA09 CPLD CPLD VCC Bus Interface ...

Page 62: ...r Phone Interface Modules can be used for a key phone interface 2B D Technology The 2B D technology has been used for configuring the digital phone interface of OfficeServ 12 basically supporting 2 voice channels The data transfer rate between the main unit and terminals is 192 Kbps 144 Kbps of which is used for information data and 48 Kbps of which is used for data needed for signal processing an...

Page 63: ... anti overvoltage circuit composed of a resistance in the secondary DLT 1 and a Zener diode is used for such purpose Figure 4 8 DLI Port Wiring Diagram 4 2 2 9 Single Line Phone Connection Interface 5SLI 2HYB The base board of the OfficeServ 12 system has five SLI circuits and two HYB hybrid circuits supporting up to seven analog phones Main devices of SLI are configured using QSLAC Quad Subscribe...

Page 64: ...current feeding Figure 4 9 Hybrid Port Wiring Diagram Figure 4 10 SLI Port Wiring Diagram 4 2 2 10 Ethernet Wireless LAN Interface A 2 1 port switch is used to support two Ethernet ports connecting to a network or an AP Device ADMTEK ADM6992 Quantity 1 Power 3 3 V 2 5 V Package 128P PQFP Supports two Ethernet ports MGI Board An MGI board must be equipped to support VoIP Voice Over IP on Ethernet T...

Page 65: ...he shunt pin selector on the base board z The selected music will be applied to stations or to the trunk lines as MOH or Background Music z The encoding part of the fourth port of the second QSLAC is used for MOH One External Paging z An external speaker is connected to this port z The decoding part of the fourth port of the second QSLAC is used for MOH One General Purpose Dry Contact The dry cont...

Page 66: ...ge Drop are used and a 1 0 F super capacitor is used for VBAT Voltage of Battery SRAM runs on approximately 3 1 V when operating on system power and uses 2 9 V backup battery power for storing data when the system power is off RTC runs on approximately 4 8 V when operating on system power and uses 2 9 V backup battery power for storing data when the system power is off In any case the minimum rete...

Page 67: ... 2 3 1 Analog Trunk Board 3 4TRK The blocks of the 3 4TRK board are shown in the figure below Figure 4 13 Analog Trunk Board 3 4TRK 2 4 Hybrid Circuit A highway is a uni directional transfer path for mass PCM data Tx path and Rx path are separately configured When A D or D A conversion is performed by CODEC Tx conversion is performed separately from Rx conversion Since a pair of copper wires must ...

Page 68: ...pto coupler and CPU loads the signal through TMC An optical device is used to separate the power of the primary part from that of the secondary part Loop Relay A calling signal is transmitted to a loop relay through the condenser resistance and Zener diode This relay is used to form or disconnect a loop and inter works with the aforementioned DC loop circuit If a relay is connected a loop will be ...

Page 69: ...e connector two RJ 45 modular jacks and one 50 pin DIN connector for connecting to the base board Two RJ 45 modular jack connectors are for the external connections to ISDN lines Features Full duplex 2B D S T interface transceiver according to CCITT Consultative Committee on International Telegraphy and Telephony I 430 Conversion of the frame structure between the S T interface and IOM ISDN Orient...

Page 70: ...h level support of layer 2 functions of the LAPD Link Access Procedure on D channel protocol It operates from a single 3 3 V supply and features a power down state with very low power consumption Analog PLL Analog PLL contains a circuit that locks 8 KHz sync signal generated by the 2BRI board and generates 4 MHz clock and FOI foe used as a reference clock for implementing Multi ISDN 4 2 4 MGI Boar...

Page 71: ...ty voice that decreases the bit rate to average 3 2 Kbps by making use of silence suppression TIA 464A DTMF detection or generation MF Multi Frequency detection or generation Parallel host processor interface Host programmable tone signal Configurable PCM interface PCM highway or parallel interface On chip PCM highway interface Allocates a host configurable time slot and interfaces with one of the...

Page 72: ... SAMSUNG Electronics Co Ltd 24 This page is intentionally left blank ...

Page 73: ... of the OfficeServ 12 system 5 1 Exploded View The exploded view of the OfficeServ 12 system is as follows Figure 5 1 Exploded View of OfficeServ 12 Item Part Name Part Number Quantity CABINET TOP GA72 00024B 1 CABINET DOOR GA72 00025C 1 MAIN PCB 1 CABINET BOTTOM GA72 00026A 1 INSULATION SHEET GA72 00101A 1 POWER GA44 00013A 1 ...

Page 74: ...OT 23 TP 0401 001134 D801 D802 2 DIODE SWITCHING BAV23C 250 V 400 MA SOT 23 TP 0402 000309 D861 1 DIODE RECTIFIER 1SR154 400 400 V 1 A SOD 106 TP 0402 001056 D122 D126 D971 6 DIODE RECTIFIER MBRS140 40 V 1 A CASE403A TP 0403 001164 ZD856 ZD859 4 DIODE ZENER MMSZ5232B 5 32 5 88 V 500 MW SOD 123 TP 0403 001396 ZD851 1 DIODE ZENER MMSZ5263B 5 500 MW SOD 123 TP 0403 001416 ZD351 ZD352 ZD361 ZD362 4 DI...

Page 75: ...1103 001289 U932 1 IC EEPROM 93C46 128x8 64x16 SOP 8P 5 4 mm 2 7 5 5 V 1105 001351 U101 U102 2 IC DRAM K4S561632A 4 M 16 4 BIT TSOP 54P 400 MI 1106 001428 U461 U462 2 IC SRAM K6F8016U6 512KX16 BIT TBGA 48P 7 6 MM 1107 001118 U121 1 IC FLASH MEMORY 29LV040 512Kx8 PLCC 32P 11 4 13 9 mm 1107 001473 U463 1 IC FLASH MEMORY 9F2808U0C 16Mx8 TSOP 48P 18 4 12 4 mm 1201 000197 U422 1 IC OP AMP MC34072 SOP T...

Page 76: ... V 1200 A 9 6 mm TP 1405 000171 V421 V422 2 VARISTOR 82 V 1200 A 9 6 mm TP 1405 000171 V502 V552 V602 V652 4 VARISTOR 82 V 1200 A 9 6 mm TP 1405 000171 V702 V752 V802 3 VARISTOR 82 V 1200 A 9 6 mm TP 2003 000147 R897 R898 2 R METAL OXIDE 100 ohm 5 2 W AA TP 6 16 mm 2007 000040 R401 1 R CHIP 150 ohm 1 1 10 W TP 1608 2007 000043 R182 R183 R202 R204 4 R CHIP 1 Kohm 1 1 10 W TP 1608 2007 000043 R402 1...

Page 77: ... W TP 1608 2007 000231 R536 R586 R636 R686 4 R CHIP 1 3 Kohm 1 1 10 W TP 1608 2007 000231 R736 R786 R836 3 R CHIP 1 3 Kohm 1 1 10 W TP 1608 2007 000287 R142 R143 R191 R194 6 R CHIP 100 OHM 1 1 10 W TP 1608 2007 000287 R351 R361 R371 3 R CHIP 100 OHM 1 1 10 W TP 1608 2007 000287 R444 R446 R448 R450 5 R CHIP 100 OHM 1 1 10 W TP 1608 2007 000475 R149 R207 2 R CHIP 1 Mohm 1 1 10 W TP 1608 2007 000483 ...

Page 78: ...TP 1608 2007 007226 R381 R383 R451 R452 5 R CHIP 49 9 ohm 1 1 10 W TP 1608 2007 007226 R901 R910 R916 R925 20 R CHIP 49 9 ohm 1 1 10 W TP 1608 2007 007226 R956 R957 R995 R999 R888 8 R CHIP 49 9 ohm 1 1 10 W TP 1608 2007 007226 R958 1 R CHIP 49 9 ohm 1 1 10 W TP 1608 2007 007443 R886 1 R CHIP 3 01 Kohm 1 1 10 W TP 1608 2007 007454 R91 R92 2 R CHIP 332 ohm 1 1 10 W TP 1608 2007 007519 R526 R527 R576...

Page 79: ...932 9 R NET 51 ohm 5 1 16 W L CHIP 8 P TP 2203 000206 C975 C977 3 C CER CHIP 100 NF 10 50 V X7R 2012 2203 000236 C310 C381 2 C CER CHIP 0 1 NF 5 50 V C0G 1608 2203 000236 C51 C302 C303 C306 C307 5 C CER CHIP 0 1 NF 5 50 V C0G 1608 2203 000236 C994 C997 4 C CER CHIP 0 1 NF 5 50 V C0G 1608 2203 000257 C311 C312 C436 3 C CER CHIP 10 NF 10 50 V X7R 1608 2203 000257 C903 C904 C918 C919 C936 5 C CER CHI...

Page 80: ...R CHIP 0 56 NF 5 50 V C0G TP 1608 2203 002080 C733 C783 C833 3 C CER CHIP 0 56 NF 5 50 V C0G TP 1608 2203 003027 C424 C441 2 C CER CHIP 0 82 NF 5 50 V NP0 TP 1608 2203 005144 C121 C123 3 C CER CHIP 1000 NF 10 10 V X7R TP 2012 2203 005144 C351 C352 C361 C362 4 C CER CHIP 1000 NF 10 10 V X7R TP 2012 2203 005144 C371 C372 C421 C422 R447 5 C CER CHIP 1000 NF 10 10 V X7R TP 2012 2203 005221 C516 C517 C...

Page 81: ...411 C414 C423 5 C CER CHIP 100 NF 10 50 V X7R TP 1608 2203 005249 C420 1 C CER CHIP 100 NF 10 50 V X7R TP 1608 2203 005249 C431 C451 C452 3 C CER CHIP 100 NF 10 50 V X7R TP 1608 2203 005249 C511 C512 C561 C562 4 C CER CHIP 100 NF 10 50 V X7R TP 1608 2203 005249 C611 C612 C661 C662 4 C CER CHIP 100 NF 10 50 V X7R TP 1608 2203 005249 C711 C712 C761 C762 4 C CER CHIP 100 NF 10 50 V X7R TP 1608 2203 0...

Page 82: ...F 470 NF 10 250 V BK 18 6 12 15 2305 000413 C354 C364 C374 3 C FILM LEAD PEF 470 NF 5 63 V TP 7 2 4 5 9 5 mm 2401 000625 C876 C877 2 C AL 2 2 uF 20 160 V GP TP 6 3 11 5 2401 003914 C872 C980 C981 3 C AL 100UF 20 100V GP TP 10 16 MM 5 2402 000130 C450 1 C AL SMD 2 2 uF 20 50 V GP TP 4 3 4 3 5 2402 000204 C448 1 C AL SMD 10 UF 20 16 V WT TP 4 3 4 3 5 4 2402 001033 C984 1 C AL SMD 220 uF 20 16 V GP T...

Page 83: ...S301 1 SWITCH SMD 6 V 100 MA SLIDE 3408 000308 S122 1 SWITCH SLIDE 30 V 200 mA DPDT 3501 001258 K501 K551 K601 K651 4 RELAY MINIATURE 5 V 100 MW 1000 MA 2FORMC 3 MS 3 MS 3501 001258 K701 K751 K801 K401 4 RELAY MINIATURE 5 V 100 MW 1000 MA 2FORMC 3 MS 3 MS 3704 000249 U121 1 SOCKET IC 32 P PLCC SN 1 27 mm 3710 000001 P421 1 CONNECTOR SHUNT 2 P 1R 2 54 MM AUF 3710 001659 P201 P202 2 CONNECTOR SOCKET...

Page 84: ...DF04S 400 V 1 A SMD 4 ST 0403 000308 ZD103 ZD203 ZD303 3 DIODE ZENER RLZ3 6A 3 455 3 695 V 500MW LL 34 TP 0403 000308 ZD104 ZD204 ZD304 3 DIODE ZENER RLZ3 6A 3 455 3 695 V 500MW LL 34 TP 0403 000549 ZD101 ZD201 ZD301 3 DIODE ZENER RLZJ24B 23 61 24 92 V 500MW LL 34 TP 0403 000549 ZD102 ZD202 ZD302 3 DIODE ZENER RLZJ24B 23 61 24 92 V 500MW LL 34 TP 0406 000147 TVS101 TVS201 TVS301 3 DIODE TVS DSSA P...

Page 85: ... 5 R CHIP 100 OHM 1 1 10 W TP 1608 2007 000297 R117 R217 R317 3 R CHIP 10 Kohm 1 1 8 W TP 2012 2007 000307 R11 R13 R21 R23 6 R CHIP 10 ohm 1 1 8 W TP 2012 2007 000307 R112 R212 R312 3 R CHIP 10 ohm 1 1 8 W TP 2012 2007 000307 R31 R33 3 R CHIP 10 ohm 1 1 8 W TP 2012 2007 000378 R155 R255 R355 3 R CHIP 13 Kohm 1 1 8 W TP 2012 2007 000392 R118 R218 R318 3 R CHIP 150 Kohm 1 1 8 W TP 2012 2007 000454 R...

Page 86: ...50 V X7R 2012 2203 000206 C152 C252 C352 3 C CER CHIP 100 NF 10 50 V X7R 2012 2203 000206 C153 C253 C353 3 C CER CHIP 100 NF 10 50 V X7R 2012 2203 000206 C51 C54 4 C CER CHIP 100 NF 10 50 V X7R 2012 2203 000239 C61 C67 7 C CER CHIP 0 1 NF 5 50 V C0G TP 2012 2203 000408 C159 C259 C359 3 C CER CHIP 0 18 NF 5 50 V C0G TP 2012 2203 000595 C157 C257 C357 3 C CER CHIP 0 22 NF 5 50 V C0G TP 2012 2203 000...

Page 87: ...RMC 4 MS 4 MS 3703 000176 P1 1 CONNECTOR BACK PANEL 50 P 2R FEMALE STRAIGHT AUF 3704 001001 P101 P201 P301 3 SOCKET IC 8 P SIP SN 2 54mm 3722 000250 P2 P3 2 JACK MODULAR 6P 6C INVERTED N ANGLE STANDARD 4715 000127 V101 V102 V103 3 SURGE ABSORBER 300 V 15 500 A 4715 000127 V201 V202 V203 3 SURGE ABSORBER 300 V 15 500 A 4715 000127 V301 V302 V303 3 SURGE ABSORBER 300 V 15 500 A GA13 00004A U51 1 IC ...

Page 88: ...L MMBT5550 NPN 300 MW SOT 23 TP 20 250 0501 000477 Q102 Q202 Q302 3 TR SMALL SIGNAL MMBT5550 NPN 300 MW SOT 23 TP 20 250 0501 000477 Q104 Q204 Q304 3 TR SMALL SIGNAL MMBT5550 NPN 300 MW SOT 23 TP 20 250 0502 000465 Q103 Q203 Q303 3 TR POWER KTD2058 NPN 25000 mW TO 220IS ST 100 200 0604 001002 U101 U201 U301 3 PHOTO COUPLER TR 100 600 200 mW SOP 4 TP 0801 000702 U52 U53 2 IC CMOS LOGIC 74HC125 BUFF...

Page 89: ...454 R164 R264 R364 3 R CHIP 18 Kohm 1 1 8 W TP 2012 2007 000465 R153 R253 R353 3 R CHIP 1 Kohm 1 1 8 W TP 2012 2007 000465 R157 R257 R357 3 R CHIP 1 Kohm 1 1 8 W TP 2012 2007 000465 R54 R56 2 R CHIP 1 Kohm 1 1 8 W TP 2012 2007 000474 R90 1 R CHIP 1 Mohm 1 1 8 W TP 2012 2007 000490 R51 R53 3 R CHIP 2 2 Kohm 1 1 8 W TP 2012 2007 000515 R156 R256 R356 3 R CHIP 2 7 Kohm 1 1 8 W TP 2012 2007 000639 R15...

Page 90: ...C156 C256 C356 3 C CER CHIP 0 56 NF 5 50 V C0G TP 2012 2203 001132 C158 C258 C358 3 C CER CHIP 0 68 NF 5 50 V NP0 TP 2012 2203 001391 C151 C251 C351 3 C CER CHIP 150 NF 10 25 V X7R TP 2012 2305 001054 C101 C201 C301 3 C FILM LEAD PEF 820 NF 10 250 V TP 18 7 5 13 5 2401 003298 C104 C204 C304 3 C AL 100 uF 20 63 V GP TP 8 11 5 5 2402 000170 C11 C12 C31 3 C AL SMD 1 uF 20 50 V GP TP 4 3 4 3 5 4 2402 ...

Page 91: ...CHING RLS4148 75 V 150 MA LL 34 TP 0401 000133 D104 D204 D304 D404 4 DIODE SWITCHING RLS4148 75 V 150 MA LL 34 TP 0402 001047 BD101 BD201 BD301 BD401 4 DIODE BRIDGE DF04S 400 V 1A SMD 4 ST 0403 000308 ZD103 ZD203 ZD303 ZD403 4 DIODE ZENER RLZ3 6A 3 455 3 695 V 500 MW LL 34 TP 0403 000308 ZD104 ZD204 ZD304 ZD404 4 DIODE ZENER RLZ3 6A 3 455 3 695 V 500 MW LL 34 TP 0403 000549 ZD101 ZD201 ZD301 ZD401...

Page 92: ... CHIP 0 ohm 5 1 8W TP 2012 2007 000070 L2 L3 2 R CHIP 0 ohm 5 1 10W TP 1608 2007 000277 R165 R265 R365 R465 4 R CHIP 100 Kohm 1 1 8W TP 2012 2007 000277 R166 R266 R366 R466 4 R CHIP 100 Kohm 1 1 8W TP 2012 2007 000277 R89 1 R CHIP 100 Kohm 1 1 8W TP 2012 2007 000286 R115 R215 R315 R415 4 R CHIP 100 ohm 1 1 8W TP 2012 2007 000286 R119 R219 R319 R419 4 R CHIP 100 ohm 1 1 8W TP 2012 2007 000286 R120 ...

Page 93: ...Kohm 1 1 8W TP 2012 2007 000827 R167 R267 R367 R467 4 R CHIP 39 Kohm 1 1 8W TP 2012 2007 000849 R124 R224 R351 R451 4 R CHIP 3 ohm 5 1 8W TP 2012 2007 000849 R91 R92 2 R CHIP 3 ohm 5 1 8W TP 2012 2007 000868 R111 R211 R311 R411 4 R CHIP 4 7 Kohm 1 1 8W TP 2012 2007 000868 R123 R223 R323 R423 4 R CHIP 4 7 Kohm 1 1 8W TP 2012 2007 000909 R159 R259 R359 R459 4 R CHIP 43 Kohm 1 1 8W TP 2012 2007 00106...

Page 94: ... C61 C67 7 C CER CHIP 0 1 NF 5 50 V C0G TP 2012 2203 000408 C159 C259 C359 C459 4 C CER CHIP 0 18 NF 5 50 V C0G TP 2012 2203 000595 C157 C257 C357 C457 4 C CER CHIP 0 22 NF 5 50 V C0G TP 2012 2203 000938 C160 C260 C360 C460 4 C CER CHIP 0 47 NF 5 50 V C0G TP 2012 2203 001058 C156 C256 C356 C456 4 C CER CHIP 0 56 NF 5 50 V C0G TP 2012 2203 001132 C158 C258 C358 C458 4 C CER CHIP 0 68 NF 5 50 V NP0 ...

Page 95: ...02 K302 2 RELAY MINIATURE 5 VDC 140 MW 2000 MA 2FORMC 4 MS 4 MS 3703 000176 P1 1 CONNECTOR BACK PANEL 50P 2R FEMALE STRAIGHT AUF 3704 001001 P101 P201 P301 P401 4 SOCKET IC 8P SIP SN 2 54 mm 3722 000250 P2 P3 2 JACK MODULAR 6P 6C INVERTED N ANGLE STANDARD 4715 000127 V101 V201 V301 V401 4 SURGE ABSORBER 300 V 15 500 A 4715 000127 V102 V202 V302 V402 4 SURGE ABSORBER 300 V 15 500 A 4715 000127 V103...

Page 96: ...ODE ZENER RLZJ24B 23 61 24 92 V 500 MW LL 34 TP 0406 000147 TVS101 TVS201 TVS301 TVS401 4 DIODE TVS DSSA P0640SA 56 V 72 V DO 21 0501 000477 Q101 Q201 Q301 Q401 4 TR SMALL SIGNAL MMBT5550 NPN 300 MW SOT 23 TP 20 250 0501 000477 Q102 Q202 Q302 Q402 4 TR SMALL SIGNAL MMBT5550 NPN 300 MW SOT 23 TP 20 250 0501 000477 Q104 Q204 Q304 Q404 4 TR SMALL SIGNAL MMBT5550 NPN 300 MW SOT 23 TP 20 250 0502 00046...

Page 97: ...4 R CHIP 100 ohm 1 1 8W TP 2012 2007 000286 R61 R62 R67 R70 R76 R83 14 R CHIP 100 ohm 1 1 8W TP 2012 2007 000287 L4 L8 5 R CHIP 100 OHM 1 1 10W TP 1608 2007 000297 R117 R217 R317 R417 4 R CHIP 10 Kohm 1 1 8W TP 2012 2007 000307 R11 R13 R21 R23 6 R CHIP 10 ohm 1 1 8W TP 2012 2007 000307 R112 R212 R312 R412 4 R CHIP 10 ohm 1 1 8W TP 2012 2007 000307 R31 R33 R41 R43 6 R CHIP 10 ohm 1 1 8W TP 2012 200...

Page 98: ... 6 8 Kohm 1 1 8W TP 2012 2007 001124 R163 R263 R363 R463 4 R CHIP 68 Kohm 1 1 8W TP 2012 2007 001195 R113 R213 R313 R413 4 R CHIP 820 Kohm 5 1 8W TP 2012 2007 001671 R168 R268 R368 R468 4 R CHIP 75 Kohm 1 1 8W TP 2012 2007 007584 R162 R262 R362 R462 4 R CHIP 73 2 Kohm 1 1 8W TP 2012 2203 000130 C154 C254 C354 C454 4 C CER CHIP 1 2 NF 5 50V C0G TP 2012 2203 000206 BC11 BC21 BC31 BC41 4 C CER CHIP 1...

Page 99: ...TP 8x11 5 5 2402 000170 C11 C12 C31 C32 4 C AL SMD 1 uF 20 50 V GP TP 4 3x4 3x5 4 2402 000170 C161 C261 C361 C461 4 C AL SMD 1 uF 20 50 V GP TP 4 3x4 3x5 4 2402 001033 C98 C99 2 C AL SMD 220 uF 20 16 V GP TP 8 3x8 3x10 2402 001034 C105 C205 C305 C405 4 C AL SMD 22 UF 20 35 V GP TP 6 6X6 6X5 4 2402 001042 C57 C58 2 C AL SMD 100 uF 20 16 V GP TP 6 6x6 6x5 4 mm 2703 000202 L1 1 INDUCTOR SMD 33 uH 10 ...

Page 100: ...00696 U2 1 IC CMOS LOGIC 74HC245 TRANSCEIVER SOP 20 300 MIL 0801 000703 U11 1 IC CMOS LOGIC 74HC126 BUFFER SOP 14 150 MIL QUAD TP 1201 000309 U51 U52 2 IC OP AMP CA3140 SOP ST 8P 150 MIL SINGLE 100 V MV 1203 001543 U81 1 IC POSI FIXED REG 78R33 TO 220 4P 400 MIL PLASTIC 1205 002283 U151 U251 2 IC SAC PEB3086H MQFP 64P 14 14 MM PLASTIC 3 3 V 1301 001407 U1 1 IC EPLD M4A5 128 64 TQFP 100P 14 14 mm 1...

Page 101: ...07 007342 R121 R122 R221 R222 4 R CHIP 1 82 Kohm 1 1 10 W TP 1608 2007 008091 R31 R32 R33 R34 4 R CHIP 4 32 Kohm 1 1 10 W TP 1608 2007 008122 R41 1 R CHIP 22 1 OHM 1 1 10 W TP 1608 2007 008141 R81 R82 2 R CHIP 3 ohm 1 1 10 W TP 1608 2007 008148 R57 1 R CHIP 121 Kohm 1 1 10 W TP 1608 2011 000151 RA3 RA4 2 R NET 100 OHM 5 1 16 W L CHIP 8P TP 3216 2203 000206 BC1 BC6 BC11 BC22 8 C CER CHIP 100 NF 10 ...

Page 102: ...XO 8 192 MHZ 20 PPM 2 TTL BK 5 V 20 MA 2901 000195 B301 1 FILTER EMI ON BOARD 50 V 1 A 330 pF 7 5 2 5 6 2 mm TP 3301 000292 L111 L112 L121 L122 4 BEAD RADIAL 100 ohm 3 5 0 6 6 5 mm 7000 mA TP 3301 000292 L211 L212 L221 L222 4 BEAD RADIAL 100 ohm 3 5 0 6 6 5 mm 7000 mA TP 3301 000344 B51 1 BEAD RADIAL 200 ohm 3 5 0 6 6 5 mm 7000 mA TP 3301 000373 L1 L8 8 BEAD SMD 220 OHM 1608 200 TP 307 OHM 346 MHZ...

Page 103: ...50 12 R CHIP 10 Kohm 1 1 10 W TP 1608 2007 000060 R46 1 R CHIP 100 Kohm 1 1 10 W TP 1608 2007 000070 R1 R3 R6 R14 R52 R61 R67 19 R CHIP 0 ohm 5 1 10 W TP 1608 2007 007226 R21 R26 R28 R30 8 R CHIP 49 9 ohm 1 1 10 W TP 1608 2007 008122 R51 1 R CHIP 22 1 OHM 1 1 10 W TP 1608 2203 000998 C11 C12 2 C CER CHIP 0 047 NF 5 50 V C0G TP 1608 2203 005249 BC1 BC16 16 C CER CHIP 100 NF 10 50 V X7R TP 1608 2404...

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Page 105: ...OfficeServ 12 SAMSUNG Electronics Co Ltd 1 PCB Component Layout This annex describes the solder side and component side layout of the OfficeServ 12 system A 1 Base board A 1 1 Component Side ...

Page 106: ... SAMSUNG Electronics Co Ltd 2 A 1 2 Solder Side ...

Page 107: ... SAMSUNG Electronics Co Ltd 3 A 2 3 4TRK Board A 2 1 Component Side ...

Page 108: ... SAMSUNG Electronics Co Ltd 4 A 2 2 Solder Side ...

Page 109: ... SAMSUNG Electronics Co Ltd 5 A 3 2BRI Board A 3 1 Component Side ...

Page 110: ... SAMSUNG Electronics Co Ltd 6 A 3 2 Solder Side ...

Page 111: ... SAMSUNG Electronics Co Ltd 7 A 4 MGI Board A 4 1 Component Side A 4 2 Solder Side ...

Page 112: ... SAMSUNG Electronics Co Ltd 8 This page is intentionally left blank ...

Page 113: ...coder CPLD Complex Programmable Logic Device CPU Central Processing Unit D D A Digital to Analog DC Direct Current DCS Digital Communication System DD Data Downstream DGP Digital Phone DID Direct Inward Dialing DISA Direct Inward System Access DLI Digital Line Interface DMC Digital line interface Module Controller DND Do Not Disturb DPIM Door Phone Interface Module DPLL Digital Phase Locked Loop D...

Page 114: ...roller ISDN Integrated Services Digital Network ITP IP Telephone K KDB Keyset Daughter Board L LAN Local Area Network LAPD Link Access Procedure on D channel LCD Liquid Crystal Display LCP Local Control Processor LCR Least Cost Routing LED Light Emitting Diode M MCP Main Control Processor MF Multi Frequency MGI Media Gateway Interface MISC Miscellaneous MMC Man Machine Command MOH Music On Hold MP...

Page 115: ...al line Module Controller QDSAL Quad Digital Adaptor for Subscriber Loops QoS Quality of Service QSLAC Quad low voltage Subscriber Line Audio processing Circuit R RAS Registration Admissions and Status signaling ROM Read Only Memory RTC Real Time Clock S SCC Serial Communication Controller SDRAM Synchronous Dynamic Random Access Memory SIO Serial Input and Output SLI Single Line Interface SLIC Sub...

Page 116: ...U UA User Agent or Universal Answer UCD Uniform Call Distribution V VAC Alternating Current VBAT Voltage of Battery VDC Volts Direct Current VoIP Voice over Internet Protocol VMS Voice Mail System W WD Watch Dog WEP Wired Equivalent Privacy WLAN Wireless Local Area Network WLI Wireless LAN Interface ...

Page 117: ...ed Information in this document is proprietary to SAMSUNG Electronics Co Ltd No information contained here may be copied translated transcribed or duplicated by any form without the prior written consent of SAMSUNG Information in this document is subject to change without notice ...

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