© SAMSUNG Electronics Co., Ltd.
4
4.2.2 Base board
Circuits of the OfficeServ 12 base board are configured as shown below:
Figure 4.3 Base board Block Diagram
Flash ROM
(NAND)
Boot ROM
DSP
(TMS320LC548)
MGI
(AC48204)
RS232C
SRAM
SRAM
RESET
MPC 855T
Buffer
RTC
QDASL
QSLAC1
CPLD
(M4A3-192/96)
Backup
QSLAC1
SLIC#1
SLIC#2
SLIC#3
SLIC#4
SLIC#5
SLIC#6
SLIC#7
Bridge
Dry Contact
MISC
DLI
SLI1
SLI2
SLI3
SLI4
SLI5
HYB1
HYB2
TRANS
TRANS
TRANS
3/4TRK,2BRI
(D B’d)
STC9604
-5 V Regulation
Ringer
(Square Wave)
Paging
Music
Connector
Summary of Contents for OfficeServ 12
Page 1: ...GANA 000029 Ed 001 OfficeServ 12 Service Manual ...
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Page 106: ... SAMSUNG Electronics Co Ltd 2 A 1 2 Solder Side ...
Page 107: ... SAMSUNG Electronics Co Ltd 3 A 2 3 4TRK Board A 2 1 Component Side ...
Page 108: ... SAMSUNG Electronics Co Ltd 4 A 2 2 Solder Side ...
Page 109: ... SAMSUNG Electronics Co Ltd 5 A 3 2BRI Board A 3 1 Component Side ...
Page 110: ... SAMSUNG Electronics Co Ltd 6 A 3 2 Solder Side ...
Page 111: ... SAMSUNG Electronics Co Ltd 7 A 4 MGI Board A 4 1 Component Side A 4 2 Solder Side ...
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