© SAMSUNG Electronics Co., Ltd.
5
(Continued)
Part No.
Location
Quantity
Part Name
Specification
2007-000052
R169, R171-R173
4
R-CHIP
10 Kohm, 1 %, 1/10 W, TP, 1608
2007-000052
R251
1
R-CHIP
10 Kohm, 1 %, 1/10 W, TP, 1608
2007-000052
R252-R255, R321-R329
13
R-CHIP
10 Kohm, 1 %, 1/10 W, TP, 1608
2007-000052
R331, R332, R343
3
R-CHIP
10 Kohm, 1 %, 1/10 W, TP, 1608
2007-000052
R421, R428, R430, R431
4
R-CHIP
10 Kohm, 1 %, 1/10 W, TP, 1608
2007-000052
R439, R443, R866, R867
4
R-CHIP
10 Kohm, 1 %, 1/10 W, TP, 1608
2007-000052
R51-R55, R57-R69
18
R-CHIP
10 Kohm, 1 %, 1/10 W, TP, 1608
2007-000052
R70, R71
2
R-CHIP
10 Kohm, 1 %, 1/10 W, TP, 1608
2007-000052
R75, R76, R95
3
R-CHIP
10 Kohm, 1 %, 1/10 W, TP, 1608
2007-000052
R941-R944, R954
5
R-CHIP
10 Kohm, 1 %, 1/10 W, TP, 1608
2007-000060
R131, R132, R440, R441
4
R-CHIP
100 Kohm, 1 %, 1/10 W, TP, 1608
2007-000060
R851-R859
9
R-CHIP
100 Kohm, 1 %, 1/10 W, TP, 1608
2007-000066
R427, R876, R877
3
R-CHIP
20 Kohm, 1 %, 1/10 W, TP, 1608
2007-000066
R881, R882
2
R-CHIP
20 Kohm, 1 %, 1/10 W, TP, 1608
2007-000070
R13, R17, R959-R962,
R974
7
R-CHIP
0 ohm, 5 %, 1/10 W, TP, 1608
2007-000070
R461-R468
8
R-CHIP
0 ohm, 5 %, 1/10 W, TP, 1608
2007-000070 R911-R914,
R926-R929
8 R-CHIP
0 ohm, 5 %, 1/10 W, TP, 1608
2007-000208
R964
1
R-CHIP
1.1 Kohm, 1 %, 1/10 W, TP, 1608
2007-000231
R536, R586, R636, R686
4
R-CHIP
1.3 Kohm, 1 %, 1/10 W, TP, 1608
2007-000231
R736, R786, R836
3
R-CHIP
1.3 Kohm, 1 %, 1/10 W, TP, 1608
2007-000287
R142, R143, R191-R194
6
R-CHIP
100 OHM, 1 %, 1/10 W, TP, 1608
2007-000287
R351, R361, R371
3
R-CHIP
100 OHM, 1 %, 1/10 W, TP, 1608
2007-000287
R444-R446, R448, R450
5
R-CHIP
100 OHM, 1 %, 1/10 W, TP, 1608
2007-000475
R149, R207
2
R-CHIP
1 Mohm, 1 %, 1/10 W, TP, 1608
2007-000483
R971-R973
3
R-CHIP
1 ohm, 5 %, 1/8 W, TP, 2012
2007-000502
R352, R362, R372
3
R-CHIP
2.2 ohm, 5 %, 1/8 W, TP, 2012
2007-000502
R353, R363, R373
3
R-CHIP
2.2 ohm, 5 %, 1/8 W, TP, 2012
2007-000669
R261, R262, R341, R342
4
R-CHIP
2 Kohm, 1 %, 1/10 W, TP, 1608
2007-000669
R344-R348, R386-R389
9
R-CHIP
2 Kohm, 1 %, 1/10 W, TP, 1608
2007-000669
R72-R74, R965
4
R-CHIP
2 Kohm, 1 %, 1/10 W, TP, 1608
2007-000841
R976
1
R-CHIP
3 Kohm, 1 %, 1/8 W, TP, 2012
2007-000954
R504, R505, R554, R555
4
R-CHIP
49.9 OHM, 1 %, 1 W, TP, 6432
2007-000954
R604, R605, R654, R655
4
R-CHIP
49.9 OHM, 1 %, 1 W, TP, 6432
2007-000954
R704, R705, R754, R755
4
R-CHIP
49.9 OHM, 1 %, 1 W, TP, 6432
2007-000954
R804, R805
2
R-CHIP
49.9 OHM, 1 %, 1 W, TP, 6432
2007-001164
R211, R212, R915, R930
4
R-CHIP
75 ohm, 1 %, 1/10 W, TP, 1608
2007-002443
R516, R517, R566, R567
4
R-CHIP
3.6 Mohm, 5 %, 1/10 W, TP, 1608
2007-002443
R616, R617, R666, R667
4
R-CHIP
3.6 Mohm, 5 %, 1/10 W, TP, 1608
2007-002443
R716, R717, R766, R767
4
R-CHIP
3.6 Mohm, 5 %, 1/10 W, TP, 1608
2007-002443
R816, R817
2
R-CHIP
3.6 Mohm, 5 %, 1/10 W, TP, 1608
Summary of Contents for OfficeServ 12
Page 1: ...GANA 000029 Ed 001 OfficeServ 12 Service Manual ...
Page 19: ... SAMSUNG Electronics Co Ltd 6 This page is intentionally left blank ...
Page 72: ... SAMSUNG Electronics Co Ltd 24 This page is intentionally left blank ...
Page 104: ... SAMSUNG Electronics Co Ltd 32 This page is intentionally left blank ...
Page 106: ... SAMSUNG Electronics Co Ltd 2 A 1 2 Solder Side ...
Page 107: ... SAMSUNG Electronics Co Ltd 3 A 2 3 4TRK Board A 2 1 Component Side ...
Page 108: ... SAMSUNG Electronics Co Ltd 4 A 2 2 Solder Side ...
Page 109: ... SAMSUNG Electronics Co Ltd 5 A 3 2BRI Board A 3 1 Component Side ...
Page 110: ... SAMSUNG Electronics Co Ltd 6 A 3 2 Solder Side ...
Page 111: ... SAMSUNG Electronics Co Ltd 7 A 4 MGI Board A 4 1 Component Side A 4 2 Solder Side ...
Page 112: ... SAMSUNG Electronics Co Ltd 8 This page is intentionally left blank ...