OfficeServ 12
© SAMSUNG Electronics Co., Ltd.
I
INTRODUCTION
Purpose
This manual provides service information such as specifications, disassembly and
reassembly, troubleshooting, exploded view, parts list, H/W block diagram, schematic
description, and PCB Diagram of the OfficeServ 12 system.
Document Content and Organization
This manual is composed of 5 chapters and annex and abbreviation as follows.
CHAPTER
1. System Specifications
This chapter introduces the hardware and specifications of the OfficeServ 12 system.
CHAPTER
2. Disassembly and Reassembly
This chapter describes how to disassemble the OfficeServ 12 system.
CHAPTER
3. Troubleshooting
This chapter describes problems that may occur while using the OfficeServ 12 system and
the solutions to such problems.
CHAPTER
4. H/W Block Diagrams and Schematic Description
This chapter describes the hardware block diagrams and provides a schematic description
of the OfficeServ 12 system.
CHAPTER
5. Exploded View and Parts List
This chapter describes the exploded view and parts list of the OfficeServ 12 system.
ANNEX
A. PCB Component Layout
This annex describes the solder side and component side layout of the OfficeServ 12 system.
ABBRIVATION
Describes the acronyms used in this manual.
Summary of Contents for OfficeServ 12
Page 1: ...GANA 000029 Ed 001 OfficeServ 12 Service Manual ...
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Page 106: ... SAMSUNG Electronics Co Ltd 2 A 1 2 Solder Side ...
Page 107: ... SAMSUNG Electronics Co Ltd 3 A 2 3 4TRK Board A 2 1 Component Side ...
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