RK3288 Hardware Design Guide
To guarantee the performance and heat dissipation of RK818, please connect it to GND
well, and the GND pins should be connected to ePAD under the chip, and enough via holes
should be placed around ePAD, as shown in Fig 5-26.
Fig 5-26
The clearance between inductors SW5 and SW6 should be more than 1.6 mm, or high
voltage caused by mutual-inductance between inductors will lead to RK818 failure. The value
of BOOST output capacitors must be more than 33uF, as shown in Fig 5-27, 5-28.
Fig 5-27
Summary of Contents for RK32 Series
Page 1: ...RK3288 Hardware Design Guide RK3288 Hardware Design Guide Revision 1 2 Jun 18 2014...
Page 2: ...RK3288 Hardware Design Guide Revision History Date Revision Description 2014 12 15 1 2...
Page 22: ...RK3288 Hardware Design Guide Fig 4 3 Fig 4 4...
Page 23: ...RK3288 Hardware Design Guide Fig 4 5...
Page 39: ...RK3288 Hardware Design Guide Fig 5 30...
Page 56: ...RK3288 Hardware Design Guide Fig 9 7 Fig 9 8...
Page 62: ...RK3288 Hardware Design Guide Fig 11 7...
Page 69: ...RK3288 Hardware Design Guide Fig 14 2 Fig 14 3...
Page 79: ...RK3288 Hardware Design Guide...
Page 102: ...RK3288 Hardware Design Guide Fig 22 7...
Page 109: ...RK3288 Hardware Design Guide Fig 23 13 Fig 23 14...
