Rockchip RK32 Series, Hardware Design Manual

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RK3288 Hardware Design Guide
pp FR-4 3.8 4.3 -
L3 Signal2 Cu 1.5 - 1oz
core FR-4 8 4.3 -
L4 Gnd2 Cu 1.5 - 1oz
pp FR-4 - 4.3
Adjust according to
thickness
L5 Power Cu 1.5 - 1oz
core FR-4 8 4.3 -
L6 Signal3 Cu 1.5 - 1oz
pp FR-4 3.8 4.3 -
L7 Signal4 Cu 1.5 - 1oz
pp FR-4 3.8 4.3 -
Bottom Gnd3 Cu 0.7 - Plating to 1oz
3.2 Design Rule

In the product planning state, recommend to choose the design in which capacitors
can be placed on the reverse side of CPU.

The size of vias under CPU is 0.2mm/0.35mm (inside/outside diameter).

In order to suppress EMI, the PCB trace must follow the 3W principle
，
and the
clearance of traces must be kept 3 times of trace width., as shown in Fig 3-1, the trace
width/clearance of traces should be 4/8mil.
Fig 3-1

Please follow 20H principle on power layer to suppress power radiation.

2mm distance should be reserved between shield wall and PCB edge.