RK3288 Hardware Design Guide
Fig 22-3
22.2 PCB Layout
USIM card socket should be placed close to 3G module, and the traces should be short
and thick. The whole trace of the SCLK and SIO signals should be surrounded by GND.
The transient current can reach more than 1.8A when the 3G module is transmitting
with its max power. It’s suggested that DCDC with large current or MOS with low
internal resistance should be used in power supply. The large storage capacitors
should be placed close to module pin, as shown in the circle of Fig 22-4. Traces should
be routed by coppor and its width should be more than 100mil.
Fig 22-4
Summary of Contents for RK32 Series
Page 1: ...RK3288 Hardware Design Guide RK3288 Hardware Design Guide Revision 1 2 Jun 18 2014...
Page 2: ...RK3288 Hardware Design Guide Revision History Date Revision Description 2014 12 15 1 2...
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