RK3288 Hardware Design Guide
PCB trace area need 312.5mil, bigger copper width is necessary to further reduce temperature
rise.
How to calculate vias amount in connection between power layers?
Above formula applies to calculate current capability for single via as well, but the copper
width should be: L=πR, "R" is the radius of hole.
For example, aperture is 0.2mm, the thickness of copper is 0.8mil
（
0.5oZ
）
, maximum
allowable temperature rise is 10
℃
, the maximum current for a single hole is about 420mA. For
5 A current, at least 13 vias with 0.2mm aperture requested. If area is limited, enlarging
aperture can decrease the number of holes.
5.3 SYR827, SYR828 PCB Layout Guide
SYR827, SYR828 pin defined as shown in below Fig 5-10.
Fig 5-10
Please place input capacitor Cin, output capacitor Cout between Vin pin, Vout pin and CND,
try to minimize loop circle area between, which will reduce power ripple, greatly improve
stability of chip as shown in Fig 5-11.
Don't fill copper inside IC, otherwise IC will be easy to be shifted in SMT, at that time only
trace connected is available. Place close to via holes close to chip (at least 10 via holes), as
shown in Fig 5-11.
Summary of Contents for RK32 Series
Page 1: ...RK3288 Hardware Design Guide RK3288 Hardware Design Guide Revision 1 2 Jun 18 2014...
Page 2: ...RK3288 Hardware Design Guide Revision History Date Revision Description 2014 12 15 1 2...
Page 22: ...RK3288 Hardware Design Guide Fig 4 3 Fig 4 4...
Page 23: ...RK3288 Hardware Design Guide Fig 4 5...
Page 39: ...RK3288 Hardware Design Guide Fig 5 30...
Page 56: ...RK3288 Hardware Design Guide Fig 9 7 Fig 9 8...
Page 62: ...RK3288 Hardware Design Guide Fig 11 7...
Page 69: ...RK3288 Hardware Design Guide Fig 14 2 Fig 14 3...
Page 79: ...RK3288 Hardware Design Guide...
Page 102: ...RK3288 Hardware Design Guide Fig 22 7...
Page 109: ...RK3288 Hardware Design Guide Fig 23 13 Fig 23 14...
