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Operating and Maintenance Instructions – 4 Design and function
Rittal Liquid Cooling Package Plus
4.2
Function
The Liquid Cooling Package Plus (LCP Plus) is essentially an air/water heat ex-
changer. It serves to dissipate high heat losses from server enclosures or for
the effective cooling of devices built into a server enclosure.
The Liquid Cooling Package Plus may, as desired, be bayed on the right or left
of a server enclosure.
Fig. 10:
Liquid Cooling Package Plus on a server enclosure
The Liquid Cooling Package Plus may also be bayed between two server en-
closures.
Fig. 11:
Liquid Cooling Package Plus between two server enclosures
Together with the bayed server enclosures, the Liquid Cooling Package Plus
forms an airtight cooling system with horizontal air routing. It places no additio-
nal demands on the room's climate control system.
The air routing in the LCP Plus supports the "front to back" cooling principle of
the devices built into the server enclosure. The fan modules draw the warm air
exhausted from the devices in the server enclosure in the entire height of the
rear area into the Liquid Cooling Package Plus, which is bayed to the side, and
then into the heat exchanger module.
In the heat exchanger module, the heated air is directed through an air/water
heat exchanger, and its thermal energy (heat losses from the server) is trans-
ferred to a cold water system. Through this, the air is cooled to a freely selec-
