Renesas M3A-HS64, User Manual

Page: 14 / 238

Overview
1.3 M3A-HS64 Board Specifications
Rev. 1.00 Apr 30, 2009 1-4
REJ11J0034-0100
1
1.3 M3A-HS64 Board Specifications
Table 1.3.1 and Table 1.3.2 describe the board specifications of the M3A-HS64.
Table 1.3.1 Board Specifications (1/2)
No. Item Description
1 CPU
•
SH7264
‚
Input (XIN) clock: 18 MHz
‚
Bus clock: 72 MHz at maximum
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CPU clock: 144 MHz at maximum
‚
Internal memory
Hi-speed internal RAM: 64 KB
Large-capacity internal RAM: 1 MB
Instruction cache: 8 KB
Operand cache: 8 KB
‚
Power supply voltage: internal - 1.2 V, I/O - 3.3 V
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208-pin QFP, 0.5 mm pitch (package code: PLQP0208KB-A)
2 External memory
•
SDRAM: 16 MB
‚
EDS1216AHTA-75E: 1 (Elpida)
•
NOR flash memory: 4 MB
‚
S29GL032N90TFI020: 1 (SPANSION)
•
NAND flash memory: 256 MB
‚
K9F2G08U0A-PCB0: 1 (Samsung)
•
Serial flash memory: 2 MB
‚
AT26DF161A-SU: 1 (ATMEL)
•
EEPROM: 16 KB
‚
HN58X24128FPIE: 1 (Renesas)
3 USB
•
USB Series-A receptacle (Mini-B receptacle is optional)
4
Connectors and
through-holes
•
H-UDI connector (36-pin or 14-pin)
•
RS-232C connector (D-sub 9-pin)
•
20-pin MIL-spec connectors
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SH7264 expansion connectors: 6 (Ports A, C to F, H, J, and K)
•
30-pin MIL-spec connectors
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SH7264 expansion connectors: 2 (Ports B and G)
•
40-pin MIL-spec connector
‚
SH7264 expansion connector: 1 (Ports E, F, and K)
5 LEDs
•
Power supply LED: 1
•
User LEDs: 2 (connected to the SH7264 I/O pins)
6 Switches
•
Reset switch: 1
•
NMI switch: 1
•
IRQ1 switch: 1
•
TEST switch: 1
•
System setting DIP switches: 6/package
•
User DIP switches: 6/package