Phytec phyCORE-PXA255, Hardware Manual

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Hints for Handling the Module
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PHYTEC Meßtechnik GmbH 2004 L-657e_0
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20 Hints for Handling the Module
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Modifications on the phyCORE-PXA255 Development Board
and Expansion Board
Removal of various components is not advisable given the compact
nature of the module. Should this nonetheless be necessary, please
ensure that the board as well as surrounding components and sockets
remain undamaged while desoldering. Overheating the board can
cause the solder pads to loosen, rendering the module inoperable.
Carefully heat neighboring connections in pairs. After a few
alternations, components can be removed with the solder-iron tip.
Alternatively, a hot air gun can be used to heat and loosen the bonds.
Caution!
If any modifications to the module are performed, regardless of their
nature, the manufacturer guarantee is voided.
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Integrating the phyCORE-PXA255 into a Target Application
Successful integration in user target circuitry greatly depends on the
adherence to the layout design rules for the GND connections of the
phyCORE module. For best results we recommend using a carrier
board design with a full GND layer. It is important to make sure that
the GND pins that have neighboring signals which are used in the
application circuitry are connected. Just for the power supply of the
module at least 6 GND pins that are located right next to the VCC
pins must be connected.