phyCARD-M [PCA-A-M1-xxx]
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PHYTEC Messtechnik GmbH 2010 L-750e_1
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Hints for Handling the phyCARD-M
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Modifications on the phyCARD Module
Removal of various components, such as the microcontroller and the
standard quartz, is not advisable given the compact nature of the
module. Should this nonetheless be necessary, please ensure that the
board as well as surrounding components and sockets remain
undamaged while de-soldering. Overheating the board can cause the
solder pads to loosen, rendering the module inoperable. Carefully heat
neighboring connections in pairs. After a few alternations,
components can be removed with the solder-iron tip. Alternatively, a
hot air gun can be used to heat and loosen the bonds.
Caution!
If any modifications to the module are performed, regardless of their
nature, the manufacturer guarantee is voided.
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Integrating the phyCARD into a Target Application
Successful integration in user target circuitry greatly depends on the
adherence to the layout design rules for the GND connections of the
phyCARD module. For best results we recommend using a carrier
board design with a full GND layer. It is important to make sure that
the GND pins that have neighboring signals which are used in the
application circuitry are connected. Just for the power supply of the
module at least 8 GND pins that are located right next to the VCC pins
must be connected
Note!
Please refer to the phyCARD Design-In Guide (LAN-051) for
additional information, layout recommendations and example
circuitry.