CHAPTER 25 RECOMMENDED SOLDERING CONDITIONS
User’s Manual U15331EJ4V1UD
367
Table 25-1. Surface Mounting Type Soldering Conditions (2/3)
(3)
µ
PD78F9489GC-8BT:
80-pin plastic QFP (14x14)
Soldering Method
Soldering Conditions
Recommended
Condition Symbol
Interface reflow
Package peak temperature: 235
°
C, Time:30 seconds max. (at 210
°
C or higher),
Count: Twice or less, Exposure limit: 7 days
Note
(after that, prebake at 125
°
C for
10 hours)
IR35-107-2
VPS
Package peak temperature: 215
°
C, Time:40 seconds max. (at 200
°
C or higher),
Count: Twice or less, Exposure limit: 7 days
Note
(after that, prebake at 125
°
C for
10 hours)
VP15-107-2
Wave soldering
Solder bath temperature: 260°C max., Time: 10 seconds max., Count: Once,
Preheating temperature: 120°C max. (package surface temperature)
WS60-107-1
Partial heating
Pin temperature: 350°C max., Time: 3 seconds max. (per pin row)
–
Note
After opening the dry peak, store it at 25
°
C or less and 65% RH or less for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
(4)
µ
PD78F9489GK-9EU: 80-pin plastic TQFP (fine pitch) (12x12)
Soldering Method
Soldering Conditions
Recommended
Condition Symbol
Interface reflow
Package peak temperature: 235
°
C, Time:30 seconds max. (at 210
°
C or higher),
Count: Twice or less, Exposure limit: 3 days
Note
(after that, prebake at 125
°
C for
10 hours)
IR35-103-2
VPS
Package peak temperature: 215
°
C, Time:40 seconds max. (at 200
°
C or higher),
Count: Twice or less, Exposure limit: 3 days
Note
(after that, prebake at 125
°
C for
10 hours)
VP15-103-2
Partial heating
Pin temperature: 350°C max., Time: 3 seconds max. (per pin row)
–
Note
After opening the dry peak, store it at 25
°
C or less and 65% RH or less for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).