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68P80400P86-O
6-1
CHAPTER 9
- MECHANICAL PARTS REWORK AND REPAIR
INTRODUCTION
The following section details the equipment and procedures needed to correctly remove and replace
specific Main Board components on the i850/i760.
Recommended Equipment
Hot Air Machine
Pace ThermoFlo 200 or similar.
Pre-heater
X-Kar 1000-S or similar.
High Performance Soldering Station
Pace HeatWise 200 with thermal recovery system or similar
Tip 1:
.6mm (0.06”) CHISEL (P/N1124-0019-P1) to fill lands (Big) during Land Preparation procedure.
Tip 2:
0.40mm (0.016”) 1/64” 60° BEVEL (P/N1124-0011-P1) to fill/level lands (Big) during Land
Preparation procedure.
Tip 3:
10.80mm (.425”) BLADE (P/N1124-0501-P1) to wick off or level solder (BGAs) during Land
Preparation procedure.
Microscope
Leica Stereozoom 6 or similar
Magnifier Lamp
5-diopter magnifier lamp.
Fume Absorber
Pace Arm-Evac 200 or similar.
Recommended Tools
Nozzles
Summary of Contents for i760
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