Motorola i760, Field Service Manual

Page: 73 / 112

PREPARING FOR FIELD LEVEL TESTING: Flip Assembly
68P80400P94-O
7-11
7.12 Flip Assembly
7.12.1 Remove Flip Assembly:
Required Tools:
Black stick.
NOTE:
i850/i760 flip components include
a Flex Connector ribbon which can
be easily torn or damaged if not
handled with care. Exercise caution
when sliding the Flex Ribbon
through the front housing slot.
1. Remove the Keypad and Main Board
from the Front Housing. Make sure the
Flip is in the open position
2. Locate the slight gap between the Right
Knuckle and Flip Assembly. (see Figure
7-10.) Align the flat tip of the Black stick
with the gap.
3. While carefully pushing the black stick
in towards the flip assembly about 2mm,
rotate the stick as if you were tightening
a screw clockwise.
4. Try to compress the flip’s hinge by
moving the stick in a scooping or
shoveling motion. Do not use any
metallic tools. (see Figure 7-11.)
5. The front housing will deflect slightly,
allowing the hinge to release it’s position
from the front housing.
6. Once the Flip Assembly is free of the
front housing, carefully feed the the Flex
Connector through the slot in the front
housing. Take extra precaution to
prevent stressing and tearing the Flex
Ribbon.
7. Angle the flex connector slightly while
prodding flex ribbon out through slot in
front housing. The flex connector will
pass through the slot, albiet tightly.
Figure 7-10.
Figure 7-11.