INSTALLATION
2
25
OPTIFLEX X200
www.krohne.com
09/2018 - 4006564001 - AD IECEX OPTIFLEX x200 R01 en
Minimum limits for all EPLs
2.3.9 OPTIFLEX 7200 S (compact converter with sensor extension version)
SINGLE PTFE PROCESS SEAL SYSTEM
Maximum limits for EPL Ga/Gb, EPL Gb, EPL Da/Db and EPL Db
Maximum limits for EPL Gc and EPL Dc
INFORMATION!
If the device has an EPDM gasket, the maximum process connection temperature is +150
°
C. If
the device has an FKM/FPM gasket, the maximum process connection temperature is +200
°
C.
Min. process temperature or
process connection temperature
Maximum ambient temperature
[
°
C]
-40
-40
-50
-38
INFORMATION!
If the device has a Kalrez
®
gasket, minimum process connection temperature is -20
°
C. If the
device has an FKM/FPM gasket, minimum process connection temperature is -40
°
C. If the
device has a Metaglas
®
adaptor, minimum process connection temperature is -30
°
C.
Temperature
class
Maximum surface
temperature
Max. process
temperature or
process connection
temperature
Maximum ambient temperature
4-20mA / HART with
or without optional
output
Fieldbus (PA/FF)
Modbus RTU
[
°
C]
T6
T85
+60
+55
+51
+85
+55
+51
T5
T100
+75
+70
+66
+100
+70
+66
T4
T135
+110
+80
+135
+80
T3
T150
+150
+80
Temperature
class
Maximum surface
temperature
Max. process
temperature or
process connection
temperature
Maximum ambient temperature
4-20mA / HART with
or without optional
output
Fieldbus (PA/FF)
Modbus RTU
[
°
C]
T6
T85
+60
+67 (+47)
1
+67
+85
+67 (+47)
1
+67
T5
T100
+75
+80 (+62)
1
+80
+100
+80 (+62)
1
+80
T4
T135
+110
+80
+135
+80
