INSTALLATION
2
19
OPTIFLEX X200
www.krohne.com
09/2018 - 4006564001 - AD IECEX OPTIFLEX x200 R01 en
Maximum limits for EPL Gc and EPL Dc
Minimum limits for all EPLs
T4
T135
+110
+76
+70
+135
+68
+60 [+55]
1
T3
T150
+150
+63
+52 [+46]
1
1
If the device has a Ø2 mm single cable probe, use the value in square brackets
Temperature
class
Maximum surface
temperature
Max.
process
temperature
or process
connection
temperature
Maximum ambient temperature
Aluminium housing
Stainless steel housing
4-20mA /
HART with
or without
optional
output
Fieldbus
(PA/FF)
Modbus RTU
4-20mA /
HART with
or without
optional
output
Fieldbus
(PA/FF)
Modbus RTU
[
°
C]
T6
T85
+60
+68 (+45)
1
+68
+68 (+45)
1
+68
+85
+65 (+42)
1
+65
+65 (+41)
1
+65
T5
T100
+75
+80 (+60)
1
+80
+80 (+60)
1
+80
+100
+79 (+57)
1
+79
+76 (+56)
1
+76
T4
T135
+110
+76
+70
+135
+68
+60 [+55]
2
T3
T150
+150
+63
+52 [+46]
2
1
Values in parentheses are for Ex ic nA-approved devices with EPL Gc
2
If the device has a Ø2mm single cable probe, use the value in square brackets
Min. process temperature or
process connection temperature
Maximum ambient temperature
Aluminium housing
Stainless steel housing
[
°
C]
-40
-40
-40
-50
-38
-38
INFORMATION!
If the device has a Kalrez
®
gasket, minimum process connection temperature is -20
°
C. If the
device has an FKM/FPM gasket, minimum process connection temperature is -40
°
C. If the
device has a Metaglas
®
adaptor, minimum process connection temperature is -30
°
C.
Temperature
class
Maximum surface
temperature
Max.
process
temperature
or process
connection
temperature
Maximum ambient temperature
Aluminium housing
Stainless steel housing
4-20mA /
HART with
or without
optional
output
Fieldbus
(PA/FF)
Modbus RTU
4-20mA /
HART with
or without
optional
output
Fieldbus
(PA/FF)
Modbus RTU
[
°
C]
