INSTALLATION
2
35
OPTIFLEX X200
www.krohne.com
09/2018 - 4006564001 - AD IECEX OPTIFLEX x200 R01 en
Maximum limits for EPL Gc and EPL Dc
Minimum limits for all EPLs
Temperature
class
Maximum surface
temperature
Max.
process
temperature
or process
connection
temperature
Maximum ambient temperature
Aluminium housing
Stainless steel housing
4-20mA /
HART with
or without
optional
output
Fieldbus
(PA/FF)
Modbus RTU
4-20mA /
HART with
or without
optional
output
Fieldbus
(PA/FF)
Modbus RTU
[
°
C]
T6
T85
+60
+67 (+47)
1
+67
+67 (+47)
1
+67
+85
+67 (+47)
1
+67
+67 (+47)
1
+67
T5
T100
+75
+80 (+62)
1
+80
+80 (+62)
1
+80
+100
+80 (+62)
1
+80
+80 (+62)
1
+80
T4
T135
+110
+80
+80
+135
+77
+76
T3
T200
+150
+75
+73
+180
+70
+68
+200
+67
+64
T2
T300
+250
+60
+55 [+58]
2
+280
+55 [+59]
2
+50 [+53]
2
+300
+52 [+56]
2
+46 [+50]
2
T1
T315
+315
+50 [+54]
2
+44 [+47]
2
1
Values in parentheses are for Ex ic nA-approved devices with EPL Gc
2
If the device has a double ceramic process seal system, use the value in square brackets
INFORMATION!
If the device has an EPDM gasket, the maximum process connection temperature is +150
°
C. If
the device has an FKM/FPM gasket, the maximum process connection temperature is +200
°
C.
Min. process temperature or
process connection temperature
Maximum ambient temperature
[
°
C]
-40
-40
-50
-38
INFORMATION!
If the device has a Kalrez
®
gasket, minimum process connection temperature is -20
°
C. If the
device has an FKM/FPM gasket, minimum process connection temperature is -40
°
C. If the
device has a Metaglas
®
adaptor, minimum process connection temperature is -30
°
C.
