INSTALLATION
2
29
OPTIFLEX X200
www.krohne.com
09/2018 - 4006564001 - AD IECEX OPTIFLEX x200 R01 en
2.3.11 OPTIFLEX 8200 C (compact converter version)
SINGLE PTFE PROCESS SEAL SYSTEM
Maximum limits for EPL Ga/Gb, EPL Gb, EPL Da/Db and EPL Db
T3
T200
+150
+80
+180
+80
+200
+80
T2
T250
+250
+80
1
Values in parentheses are for Ex ic nA-approved devices with EPL Gc
INFORMATION!
If the device has an EPDM gasket, the maximum process connection temperature is +150
°
C. If
the device has an FKM/FPM gasket, the maximum process connection temperature is +200
°
C.
INFORMATION!
Minimum limits for all EPLs
Minimum limits for all EPLs
Minimum limits for all EPLs
Minimum limits for all EPLs
The minimum ambient temperature is always -40
°
C.
Temperature
class
Maximum surface
temperature
Max.
process
temperature
or process
connection
temperature
Maximum ambient temperature
Aluminium housing
Stainless steel housing
4-20mA /
HART with
or without
optional
output
Fieldbus
(PA/FF)
Modbus RTU
4-20mA /
HART with
or without
optional
output
Fieldbus
(PA/FF)
Modbus RTU
[
°
C]
T6
T85
+60
+54
+50
+54
+50
+85
+51
+47
+52
+46
T5
T100
+75
+69
+65
+69
+65
+100
+66
+62
+67
+61
T4
T135
+110
+79
+78
+135
+74
+71
T3
T200
+150
+71
+67
+180
+65
+66 [+59]
1
+200
+61
+62 [+53]
1
T2
T300
+250
+56 [+51]
1
+52 [+40]
1
+280
+51 [+45]
1
+47 [+31]
1
+300
+47 [+41]
1
+43 [+26]
1
1
If the device has a Ø2mm single cable probe that was part of an OPTIFLEX 1300 (HT version), use the value in square brackets
Temperature
class
Maximum surface
temperature
Max. process
temperature or
process connection
temperature
Maximum ambient temperature
4-20mA / HART with
or without optional
output
Fieldbus (PA/FF)
Modbus RTU
[
°
C]
