2
INSTALLATION
26
OPTIFLEX X200
www.krohne.com
09/2018 - 4006564001 - AD IECEX OPTIFLEX x200 R01 en
SINGLE CERAMIC PROCESS SEAL SYSTEM
Maximum limits for EPL Ga/Gb, EPL Gb, EPL Da/Db and EPL Db
Maximum limits for EPL Gc and EPL Dc
T3
T150
+150
+80
1
Values in parentheses are for Ex ic nA-approved devices with EPL Gc
INFORMATION!
Minimum limits for all EPLs
Minimum limits for all EPLs
Minimum limits for all EPLs
Minimum limits for all EPLs
The minimum ambient temperature is always -40
°
C.
Temperature
class
Maximum surface
temperature
Max. process
temperature or
process connection
temperature
Maximum ambient temperature
4-20mA / HART with
or without optional
output
Fieldbus (PA/FF)
Modbus RTU
[
°
C]
T6
T85
+60
+55
+51
+85
+55
+51
T5
T100
+75
+70
+66
+100
+70
+66
T4
T135
+110
+80
+135
+80
T3
T200
+150
+80
+180
+80
+200
+80
T2
T250
+250
+80
Temperature
class
Maximum surface
temperature
Max. process
temperature or
process connection
temperature
Maximum ambient temperature
4-20mA / HART with
or without optional
output
Fieldbus (PA/FF)
Modbus RTU
[
°
C]
T6
T85
+60
+67 (+47)
1
+67
+85
+67 (+47)
1
+67
T5
T100
+75
+80 (+62)
1
+80
+100
+80 (+62)
1
+80
T4
+135
+110
+80
+135
+80
Temperature
class
Maximum surface
temperature
Max. process
temperature or
process connection
temperature
Maximum ambient temperature
4-20mA / HART with
or without optional
output
Fieldbus (PA/FF)
Modbus RTU
[
°
C]
