2
INSTALLATION
18
OPTIFLEX X200
www.krohne.com
09/2018 - 4006564001 - AD IECEX OPTIFLEX x200 R01 en
Minimum limits for all EPLs
2.3.6 OPTIFLEX 7200 C (compact converter version)
SINGLE PTFE PROCESS SEAL SYSTEM
Maximum limits for EPL Ga/Gb, EPL Gb, EPL Da/Db and EPL Db
T3
T200
+150
+65
+56
+180
+56
+43
+200
+50
+35
1
Values in parentheses are for Ex ic nA-approved devices with EPL Gc
INFORMATION!
If the device has an EPDM gasket, the maximum process connection temperature is +150
°
C.
Min. process temperature or
process connection temperature
Maximum ambient temperature
Aluminium housing
Stainless steel housing
[
°
C]
-40
-40
-40
-50
-36
-35
INFORMATION!
If the device has a Kalrez
®
gasket, minimum process connection temperature is -20
°
C. If the
device has an FKM/FPM gasket, minimum process connection temperature is -40
°
C.
Temperature
class
Maximum surface
temperature
Max.
process
temperature
or process
connection
temperature
Maximum ambient temperature
Aluminium housing
Stainless steel housing
4-20mA /
HART with
or without
optional
output
Fieldbus
(PA/FF)
Modbus RTU
4-20mA /
HART with
or without
optional
output
Fieldbus
(PA/FF)
Modbus RTU
[
°
C]
T6
T85
+60
+54
+50
+54
+49
+85
+51
+45
+50
+42
T5
T100
+75
+69
+65
+69
+64
+100
+66
+60
+65
+57
Temperature
class
Maximum surface
temperature
Max.
process
temperature
or process
connection
temperature
Maximum ambient temperature
Aluminium housing
Stainless steel housing
4-20mA /
HART with
or without
optional
output
Fieldbus
(PA/FF)
Modbus RTU
4-20mA /
HART with
or without
optional
output
Fieldbus
(PA/FF)
Modbus RTU
[
°
C]
