CP307
Power Considerations
ID 34424, Rev. 3.0
Page 5 - 7
P R E L I M I N A R Y
5.2
Power Consumption
The goal of this description is to provide a method to calculate the power consumption for the
CP307 baseboard and for additional configurations. The processor dissipates the majority of
the thermal power.
The power consumption tables below list the voltage and power specifications for the CP307
board and the CP307 accessories. The values were measured using an 8-slot passive Com-
pactPCI backplane with two power supplies: one for the CP307 (5V and 3.3V power supply),
and the other for the hard disk. The operating systems used were DOS, Linux and Windows
®
XP. All measurements were conducted at a temperature of 25°C. The measured values varied,
because the power consumption was dependent on processor activity.
For the power consumption measurements, the CP307 was populated with the following pro-
cessors:
• Intel® Core™ Duo processor U2500 (ULV), 1.2 GHz, 533 MHz FSB, 2 MB L2 cache
• Intel® Core™ Duo processor L2400 (LV), 1.66 GHz, 667 MHz FSB, 2 MB L2 cache
• Intel® Core™ Duo processor T2500 (SV), 2.0 GHz, 667 MHz FSB, 2 MB L2 cache
• Intel® Core™2 Duo processor L7400 (LV), 1.5 GHz, 667 MHz FSB, 4 MB L2 cache
• Intel® Core™2 Duo processor T7400 (SV), 2.16 GHz, 667 MHz FSB, 4 MB L2 cache
In addition, the following testing conditions were present during the power consumption mea-
surements:
• DOS
With this operating system only one processor core was active. This operating system
has no power management support and provides a very simple method to verify the mea-
sured power consumption values.
• Linux/Windows® XP, IDLE Mode
With these operating systems both processor cores were in IDLE state.
and under the following testing conditions:
• CP307 Thermal Design Power (TDP) at 75%
These values represent the “typical” maximum power dissipation reached under OS-con-
trolled applications.
• CP307 Thermal Design Power (TDP) at 100%
These values represent the maximum power dissipation achieved through the use of
specific tools to heat up the processor cores. 100% TDP is unlikely to be reached in real
applications.
The following tables indicate the power consumption with soldered DDR2 SDRAM (there was
no SODIMM memory module mounted on the CP307). For measurements made with the Linux
and Windows® XP operating systems, the VGA resolution was 1024 x 768 pixels.
Note ...
The power consumption values indicated in the tables below can vary depend-
ing on the ambient temperature or the system performance. This can result in
deviations of the power consumption values of up to 10%.
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