Thermal Considerations
CP307
Page 6 - 6
ID 34424, Rev. 3.0
P R E L I M I N A R Y
6.2.2
Forced Airflow
When developing applications using the CP307, the system integrator must be aware of the
overall system thermal requirements. System chassis must be provided which satisfy these re-
quirements. As an aid to the system integrator, characteristics graphs are provided for the
CP307.
The values have been measured using typical applications running under Linux/Windows® XP.
In worst case situations, the values vary and the temperature range must be reduced. In all sit-
uations, the maximum case temperature of the Intel® Core™ Duo and the Intel® Core™2 Duo
processors must be kept below the maximum allowable temperature. This temperature value
can be measured with the temperature sensor integrated in the CPU. To ensure functionality
at the maximum temperature, the BIOS supports a temperature control feature. In instances of
overtemperature, the hardware monitor will reduce the power consumption.
The maximum case temperatures for all processor types is as follows:
• Intel® Core™ Duo: all versions: 100°C
• Intel® Core™2 Duo: all versions: 100°C
6.2.3
Thermal Characteristic Graphs
The thermal characteristic graphs shown on the following pages illustrate the maximum ambi-
ent air temperature as a function of the volumetric airflow rate for the power consumption indi-
cated. The diagrams are intended to serve as guidance for reconciling board and system with
the required computing power considering the thermal aspect. One diagram per CPU version
is provided. There are up to two curves representing upper level working points based on dif-
ferent levels of average CPU utilization. When operating below the corresponding curve, the
CPU runs steadily without any intervention of thermal supervision. When operated above the
corresponding curve, various thermal protection mechanisms may take effect resulting in tem-
porarily reduced CPU performance or finally in an emergency stop in order to protect the CPU
from thermal destruction. In real applications this means that the board can be operated tem-
porarily at a higher ambient temperature or at a reduced flow rate and still provide some margin
for temporarily requested peak performance before thermal protection will be activated.
TDP curves
• 100% TDP curve
This load complies with the maximum thermal design power (TDP) indicated in Chap-
ter 5.2 Power Consumption, Table 5-7. 100% TDP can be achieved through the use
of specific tools to heat up the CPU but 100% TDP is unlikely to be reached in real
applications.
• 75% TDP curve
This load represents a "typical" maximum power dissipation reached under OS-con-
trolled applications. Typically, this load corresponds with 75% of the TDP (see Chapter
5.2 Power Consumption, Table 5-6).
How to read the diagram
Select a specific CPU and choose a specific working point. For a given flow rate there is a max-
imum airflow input temperature (= ambient temperature) provided. Below this operating point,
thermal supervision will not be activated. Above this operating point, thermal supervision will
become active protecting the CPU from thermal destruction. The minimum airflow rate provid-
ed must not be less than the value specified in the diagram.
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