COMe-bKL6 – User Guide Rev.1.2
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2.5. Thermal Management ............................................................................................................................................................................ 31
2.5.1. Heatspreader and Active or Passive Cooling Solutions ............................................................................................................ 31
2.5.2. Active or Passive Cooling Solutions ................................................................................................................................................ 31
2.5.3. Operating with Kontron Heatspreader Plate (HSP) Assembly............................................................................................... 31
2.5.4. Operating without Kontron Heatspreader Plate (HSP) Assembly ........................................................................................ 31
2.5.5. On Board Fan Connector .................................................................................................................................................................... 32
2.6. Environmental Specification................................................................................................................................................................ 33
2.6.1. Temperature........................................................................................................................................................................................... 33
2.6.2. Humidity .................................................................................................................................................................................................. 33
2.7. Standards and Certifications ............................................................................................................................................................... 34
2.8. Mechanical Specification ...................................................................................................................................................................... 35
2.8.1. Dimensions ............................................................................................................................................................................................. 35
2.8.2. Height ....................................................................................................................................................................................................... 35
2.8.3. Heatspreader Dimensions ................................................................................................................................................................ 36
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Features and Interfaces .................................................................................................................................................................. 37
3.1. LPC ................................................................................................................................................................................................................. 37
3.2. Serial Peripheral Interface (SPI) ......................................................................................................................................................... 37
3.2.1. SPI boot .................................................................................................................................................................................................... 38
3.2.2. Using an External SPI Flash .............................................................................................................................................................. 38
3.2.3. External SPI flash on Modules with Intel® ME ........................................................................................................................... 39
3.3. Fast I2C ........................................................................................................................................................................................................ 39
3.4. UART ............................................................................................................................................................................................................ 39
3.5. Dual Staged Watchdog Timer (WTD) ................................................................................................................................................ 39
3.5.1. WDT Signal .............................................................................................................................................................................................. 40
3.6. Real Time Clock (RTC) ............................................................................................................................................................................ 40
3.7. GPIO .............................................................................................................................................................................................................. 40
3.8. Trusted Platform Module (TPM 2.0) .................................................................................................................................................. 41
3.9. Kontron Security Solution ...................................................................................................................................................................... 41
3.10. SpeedStep® Technology ....................................................................................................................................................................... 41
3.11. Intel® Optane™ Memory ....................................................................................................................................................................... 41
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System Resources ............................................................................................................................................................................. 43
4.1. Interrupt Request (IRQ) Lines .............................................................................................................................................................. 43
4.2. Memory Area ............................................................................................................................................................................................ 43
4.3. I/O Address Map ...................................................................................................................................................................................... 44
4.4. Peripheral Component Interconnect (PCI) Devices ..................................................................................................................... 45
4.5. I2C Bus ......................................................................................................................................................................................................... 45
4.6. System Management (SM) Bus .......................................................................................................................................................... 46
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COMe Interface Connectors ........................................................................................................................................................... 47
5.1. X1A and X1B Signals ................................................................................................................................................................................. 47
5.2. X1A and X1B Pin Assignment ................................................................................................................................................................ 48
5.2.1. Connector X1A Row A1 - A110 ............................................................................................................................................................ 49
5.2.2. Connector X1A Row B1 - B100 .......................................................................................................................................................... 52
5.2.3. Connector X1B Row C1 - C110 ............................................................................................................................................................ 55
5.2.4. Connector X1B Row D1 - D110 ........................................................................................................................................................... 58
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uEFI BIOS ................................................................................................................................................................................................ 61
6.1. Starting the uEFI BIOS .............................................................................................................................................................................. 61
6.2. Setup Menus ............................................................................................................................................................................................. 62
6.2.1. Main Setup Menu .................................................................................................................................................................................. 63
6.2.2. Advanced Setup Menu ........................................................................................................................................................................ 65
