1-2
Intel
®
Pentium
®
III Processor with 512KB L2 Cache Dual Processor Platform Design Guide
NOTE:
1. Unless otherwise noted, this reference material can be found on the Intel Developer’s Website located at http://
developer.intel.com.
2. For a complete listing of Intel® Pentium® III processor reference material, please refer to the Intel Developer’s Website at http:/
/developer.intel.com/design/PentiumIII/
1.3
Conventions and Terminology
For this document, the following terminology applies.
•
Intel
®
Pentium
®
III Processor (CPUID 068xh) with AGTL Capability - Intel
®
Pentium
®
III
Processor based on Intel’s 0.18-micron technology with AGTL (1.25 V
TT
) interface support. This
processor contains 256KB of L2 cache and is dual-processor capable.
•
Intel® Pentium® III Processor with 512KB L2 Cache - Intel
®
Pentium
®
III
Processor based on
Intel’s 0.13-micron (i.e. 1.25V V
TT
/ AGTL) technology. This processor contains 512KB of L2 cache
and is dual-processor capable.
•
PGA370 socket - 370-pin Zero Insertion Force (ZIF) socket which a FC-PGA or FC-PGA2 packaged
processor plugs into.
•
FC-PGA - Flip Chip Pin Grid Array. The package technology used on Intel
®
Pentium
®
III Processor
(CPUID 068xh) for the PGA370 socket. The FC-PGA package has the processor die exposed.
•
FC-PGA2 - Flip Chip Pin Grid Array 2. The package technology used on the Intel
®
Pentium
®
III
Processor with 512KB L2 Cache and some Intel
®
Pentium
®
III Processors (CPUID 068xh) for the
PGA370 socket. The FC-PGA2 package contains an Integrated Heat Spreader which covers the
processor die.
•
Keep-out zone - The area on or near a FC-PGA packaged processor that system designs can not
utilize.
•
Processor - For this document, the term processor is the generic form of the Intel
®
Pentium
®
III
Processor with 512KB L2 Cache for the PGA370 socket in the FC-PGA2 package.
•
Integrated Heat Spreader (IHS) - The Integrated Heat Spreader (IHS) is a metal cover on the die
and it is an integral part of the CPU. The IHS promotes heat spreading away from the die backside to
ease thermal constraints.
•
AGTL compatible processor - Generic term for Intel
®
Pentium
®
III Processors which are
compatible with AGTL signalling voltage levels (1.25V). These processors are the Intel
®
Pentium
®
III
Processor (CPUID 068xh) with AGTL Capability and the Intel® Pentium® III Processor with 512KB
L2 Cache.
•
AGTL+ only processor - Generic term for Intel
®
Pentium
®
III Processors which can only use AGTL+
signalling voltage levels (1.5V). These processors are Intel
®
Pentium
®
III Processors (CPUID 068xh)
which do not have AGTL compatibility.
Intel® Pentium® III Processor in the FC-PGA2 Package Thermal Design Guidelines
249660
VRM 8.5 DC-DC Converter Design Guidelines
249659
Intel® Pentium® III Processor with 512KB L2 Cache Bus Terminator Design Guide
249661
Intel® Pentium® III Processor (CPUID 06Bxh) BSDL Files
Intel® Pentium® III Processor with 512KB L2 Cache DP I/O Buffer Models
Document
Intel Order Number
