Intel
®
Pentium
®
III Processor with 512KB L2 Cache Dual Processor Platform Design Guide
7-3
7.2.3
VRM 8.5 Modules
The VRM 8.5 DC-DC Converter Design Guidelines introduces a new connector for the VRM module.
This new module design has more input and output voltage pins to handle higher current demands. It
also provides better electrical characteristics.
The module keepout area has also changed in the new design. Volumetrically, the module is smaller than
the VRM 8.4 module design. The new connector is now longer, but results in a smaller overall board
area.
Please refer to the VRM 8.5 DC-DC Converter Design Guidelines from Intel for more information.
7.3
Package Changes (FC-PGA2)
The Intel
®
Pentium
®
III Processor with 512KB L2 Cache introduces a new packaging technology termed
the FC-PGA2. The FC-PGA2 package leverages the previous FC-PGA package technology used on
previous PGA370 socket processors. The FC-PGA2 package adds an Integrated Heat Spreader (IHS) to
improve heat conduction from the processor die. The new package prevents the need for exotic thermal
solutions in higher power density processors. The Intel
®
Pentium
®
III Processor with 512KB L2 Cache
can be cooled using the existing Intel
®
Pentium
®
III Processor (CPUID 068xh) thermal solutions.
Figure 7-3
shows the changes to the package mechanicals between the FC-PGA and FC-PGA2
designs. Because of the additional height of the Integrated Heat Spreader (IHS), it may be necessary to
accommodate an overall taller cooling solution. In addition, on the FC-PGA2, the heatsink is attached
Figure 7-2. Active Voltage Positioning Operating Parameters
-100
-80
-60
-40
-20
0
20
40
60
80
100
0
5
10
15
20
25
30
Icc Load (A)
V
c
c
d
ro
o
p
fr
o
m
V
ID
s
et
ti
n
g
(m
V
)
Transient Maximum
Static Maximum
Transient Minimum
Static Minimum
