79
Thermal Specifications
6
Thermal Specifications
6.1
Package Thermal Specifications
The Quad-Core Intel® Xeon® Processor 5400 Series requires a thermal solution to
maintain temperatures within its operating limits. Any attempt to operate the processor
outside these operating limits may result in permanent damage to the processor and
potentially other components within the system. As processor technology changes,
thermal management becomes increasingly crucial when building computer systems.
Maintaining the proper thermal environment is key to reliable, long-term system
operation.
A complete solution includes both component and system level thermal management
features. Component level thermal solutions can include active or passive heatsinks
attached to the processor integrated heat spreader (IHS). Typical system level thermal
solutions may consist of system fans combined with ducting and venting.
This section provides data necessary for developing a complete thermal solution. For
more information on designing a component level thermal solution, refer to the Quad-
Core Intel® Xeon® Processor 5400 Series Thermal/Mechanical Design Guidelines
(TMDG).
Note:
The boxed processor will ship with a component thermal solution. Refer to
Chapter 8
for details on the boxed processor.
6.1.1
Thermal Specifications
To allow the optimal operation and long-term reliability of Intel processor-based
systems, the processor must remain within the minimum and maximum case
temperature (TCASE) specifications as defined by the applicable thermal profile (see
Table 6-1
and
Figure 6-1
for the Quad-Core Intel® Xeon® Processor X5482,
Table 6-3
and
Figure 6-2
for the Quad-Core Intel® Xeon® Processor X5400 Series,
Table 6-6
and
Figure 6-3
for the Quad-Core Intel® Xeon® Processor E5400 Series,
Table 6-8
and
Figure 6-4
for the Quad-Core Intel® Xeon® Processor L5400 Series and
Table 6-11
and
Figure 6-5
for the Quad-Core Intel® Xeon® Processor L5408. Thermal solutions
not designed to provide this level of thermal capability may affect the long-term
reliability of the processor and system. For more details on thermal solution design,
please refer to the Quad-Core Intel® Xeon® Processor 5400 Series
Thermal/Mechanical Design Guidelines (TMDG) or Quad-Core Intel® Xeon® Processor
L5408 Series in Embedded Applications Thermal/Mechanical Design Guidelines (TMDG).
The Quad-Core Intel® Xeon® Processor 5400 Series implements a methodology for
managing processor temperatures which is intended to support acoustic noise
reduction through fan speed control and to assure processor reliability. Selection of the
appropriate fan speed is based on the relative temperature data reported by the
processor’s Platform Environment Control Interface (PECI) bus as described in
Section 6.3
. If the value reported via PECI is less than T
CONTROL
, then the case
temperature is permitted to exceed the Thermal Profile. If the value reported via PECI
is greater than or equal to T
CONTROL
, then the processor case temperature must remain
at or below the temperature as specified by the thermal profile. The temperature
reported over PECI is always a negative value and represents a delta below the onset of
thermal control circuit (TCC) activation, as indicated by PROCHOT# (see
Section 6.2
,
Summary of Contents for E5420 - CPU XEON QUAD CORE 2.50GHZ FSB1333MHZ 12M LGA771 HALOGEN FREE TRAY
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Page 107: ...107 Boxed Processor Specifications Figure 8 5 Top Side Board Keepout Zones Part 2 ...
Page 108: ...Boxed Processor Specifications 108 Figure 8 6 Bottom Side Board Keepout Zones ...
Page 109: ...109 Boxed Processor Specifications Figure 8 7 Board Mounting Hole Keepout Zones ...
Page 110: ...Boxed Processor Specifications 110 Figure 8 8 Volumetric Height Keep Ins ...
