27
Quad-Core Intel® Xeon® Processor 5400 Series Electrical Specifications
Notes:
1.
For functional operation, all processor electrical, signal quality, mechanical and thermal specifications must
be satisfied.
2.
Overshoot and undershoot voltage guidelines for input, output, and I/O signals are outlined in
Chapter 3
.
Excessive overshoot or undershoot on any signal will likely result in permanent damage to the processor.
3.
Storage temperature is applicable to storage conditions only. In this scenario, the processor must not
receive a clock, and no lands can be connected to a voltage bias. Storage within these limits will not affect
the long-term reliability of the device. For functional operation, please refer to the processor case
temperature specifications.
4.
This rating applies to the processor and does not include any tray or packaging.
5.
Failure to adhere to this specification can affect the long-term reliability of the processor.
2.13
Processor DC Specifications
The processor DC specifications in this section are defined at the processor die
(pads) unless noted otherwise. See
Chapter 4
for the Quad-Core Intel® Xeon®
Processor 5400 Series land listings and
Chapter 5
for signal definitions. Voltage and
current specifications are detailed in
Table 2-12
. For platform planning refer to
Table 2-13
and
Table 2-14
, which provides V
CC
static and transient tolerances. This
same information is presented graphically in
Figure 2-8
and
Figure 2-4
.
The FSB clock signal group is detailed in
Table 2-20
. BSEL[2:0] and VID[6:1] signals
are specified in
Table 2-15
. The DC specifications for the AGTL+ signals are listed in
Table 2-16
. Legacy signals and Test Access Port (TAP) signals follow DC specifications
similar to GTL+. The DC specifications for the PWRGOOD input and TAP signal group
are listed in
Table 2-16
.
Table 2-12
through
Table 2-18
list the DC specifications for the processor and are valid
only while meeting specifications for case temperature (T
CASE
as specified in
Chapter 6,
“Thermal Specifications”
), clock frequency, and input voltages. Care should be taken to
read all notes associated with each parameter.
2.13.1
Flexible Motherboard Guidelines (FMB)
The Flexible Motherboard (FMB) guidelines are estimates of the maximum values the
Quad-Core Intel® Xeon® Processor 5400 Series will have over certain time periods.
The values are only estimates and actual specifications for future processors may differ.
Processors may or may not have specifications equal to the FMB value in the
foreseeable future. System designers should meet the FMB values to ensure their
systems will be compatible with future Quad-Core Intel® Xeon® Processor 5400
Series.
Table 2-11. Processor Absolute Maximum Ratings
Symbol
Parameter
Min
Max
Unit
Notes
1, 2
V
CC
Core voltage with respect to V
SS
-0.30
1.35
V
V
TT
FSB termination voltage with respect to V
SS
-0.30
1.45
V
T
CASE
Processor case temperature
See
Chapter 6
See
Chapter 6
°
C
T
STORAGE
Storage temperature
-40
85
°
C
3, 4, 5
Summary of Contents for E5420 - CPU XEON QUAD CORE 2.50GHZ FSB1333MHZ 12M LGA771 HALOGEN FREE TRAY
Page 1: ...318589 005 Quad Core Intel Xeon Processor 5400 Series Datasheet August 2008 ...
Page 8: ...8 Quad Core Intel Xeon Processor 5400 Series Datasheet ...
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Page 106: ...Boxed Processor Specifications 106 Figure 8 4 Top Side Board Keepout Zones Part 1 ...
Page 107: ...107 Boxed Processor Specifications Figure 8 5 Top Side Board Keepout Zones Part 2 ...
Page 108: ...Boxed Processor Specifications 108 Figure 8 6 Bottom Side Board Keepout Zones ...
Page 109: ...109 Boxed Processor Specifications Figure 8 7 Board Mounting Hole Keepout Zones ...
Page 110: ...Boxed Processor Specifications 110 Figure 8 8 Volumetric Height Keep Ins ...
