83
Thermal Specifications
Notes:
1.
These values are specified at V
CC_MAX
for all processor frequencies. Systems must be designed to ensure
the processor is not to be subjected to any static V
CC
and I
CC
combination wherein V
CC
exceeds V
CC_MAX
at
specified ICC. Please refer to the loadline specifications in
Section 2.13.1
.
2.
Thermal Design Power (TDP) should be used for the processor thermal solution design targets. TDP is not
the maximum power that the processor can dissipate. TDP is measured at maximum T
CASE
.
3.
These specifications are based on silicon characterization.
4.
Power specifications are defined at all VIDs found in
Table 2-3
. The Quad-Core Intel® Xeon® Processor
X5400 Series may be shipped under multiple VIDs for each frequency.
5.
FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor
frequency requirements.
Notes:
1.
Thermal Profile A is representative of a volumetrically unconstrained platform. Please refer to
Table 6-4
for
discrete points that constitute the thermal profile.
2.
Implementation of the Quad-Core Intel® Xeon® Processor X5400 Series
Thermal Profile A should result in
virtually no TCC activation. Furthermore, utilization of thermal solutions that do not meet Thermal Profile A
will result in increased probability of TCC activation and may incur measurable performance loss. (See
Section 6.2
for details on TCC activation).
3.
Thermal Profile B is representative of a volumetrically constrained platform. Please refer to
Table 6-5
for
discrete points that constitute the thermal profile.
4.
Implementation of the Quad-Core Intel® Xeon® Processor X5400 Series
Thermal Profile B will result in
increased probability of TCC activation and measurable performance loss. Furthermore, utilization of
thermal solutions that do not meet Thermal Profile B do not meet the processor’s thermal specifications
and may result in permanent damage to the processor.
5.
Refer to the Quad-Core Intel® Xeon® Processor 5400 Series Thermal/Mechanical Design Guidelines
(TMDG) for system and environmental implementation details.
Table 6-3.
Quad-Core Intel® Xeon® Processor X5400 Series Thermal Specifications
Core
Frequency
Thermal
Design Power
(W)
Minimum
T
CASE
(°C)
Maximum
T
CASE
(°C)
Notes
Launch to FMB
120
5
See
Figure 6-2
;
Table 6-4
;
Table 6-5
1, 2, 3, 4, 5
Figure 6-2. Quad-Core Intel® Xeon® Processor X5400 Series Thermal Profiles A and B
40
45
50
55
60
65
70
75
0
10
20
30
40
50
60
70
80
90
100
110
120
Pow er [W]
Tc
a
s
e
[
C
]
TCASE_MAX is a thermal solution design point. In actuality, units
will not significantly exceed TCASE_MAX_A due to TCC activation.
Thermal Profile A
Y = 0.168*x + 42.8
Thermal Profile B
Y = 0.221*x + 43.5
40
45
50
55
60
65
70
75
0
10
20
30
40
50
60
70
80
90
100
110
120
Pow er [W]
Tc
a
s
e
[
C
]
40
45
50
55
60
65
70
75
0
10
20
30
40
50
60
70
80
90
100
110
120
Pow er [W]
Tc
a
s
e
[
C
]
TCASE_MAX is a thermal solution design point. In actuality, units
will not significantly exceed TCASE_MAX_A due to TCC activation.
Thermal Profile A
Y = 0.168*x + 42.8
Thermal Profile B
Y = 0.221*x + 43.5
Summary of Contents for E5420 - CPU XEON QUAD CORE 2.50GHZ FSB1333MHZ 12M LGA771 HALOGEN FREE TRAY
Page 1: ...318589 005 Quad Core Intel Xeon Processor 5400 Series Datasheet August 2008 ...
Page 8: ...8 Quad Core Intel Xeon Processor 5400 Series Datasheet ...
Page 14: ...14 ...
Page 106: ...Boxed Processor Specifications 106 Figure 8 4 Top Side Board Keepout Zones Part 1 ...
Page 107: ...107 Boxed Processor Specifications Figure 8 5 Top Side Board Keepout Zones Part 2 ...
Page 108: ...Boxed Processor Specifications 108 Figure 8 6 Bottom Side Board Keepout Zones ...
Page 109: ...109 Boxed Processor Specifications Figure 8 7 Board Mounting Hole Keepout Zones ...
Page 110: ...Boxed Processor Specifications 110 Figure 8 8 Volumetric Height Keep Ins ...
