87
Thermal Specifications
Notes:
1.
These values are specified at V
CC_MAX
for all processor frequencies. Systems must be designed to ensure
the processor is not to be subjected to any static VCC and ICC combination wherein VCC exceeds V
CC_MAX
at specified ICC. Please refer to the loadline specifications in
Section 2.13
.
2.
Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the
maximum power that the processor can dissipate. TDP is measured at maximum T
CASE
.
3.
These specifications are based pre-silicon estimates and simulations. These specifications will be updated
with characterized data from silicon measurements in a future release of this document.
4.
Power specifications are defined at all VIDs found in
Table 2-12
. The Quad-Core Intel® Xeon® Processor
L5400 Series may be shipped under multiple VIDs for each frequency.
5.
FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor
frequency requirements.
Notes:
1.
Please refer to
Table 6-9
for discrete points that constitute the thermal profile.
2.
Implementation of the Quad-Core Intel® Xeon® Processor L5400 Series Thermal Profile should result in
virtually no TCC activation. Furthermore, utilization of thermal solutions that do not meet the processor
Thermal Profile will result in increased probability of TCC activation and may incur measurable performance
loss. (See
Section 6.2
for details on TCC activation).
3.
Refer to the Quad-Core Intel® Xeon® Processor 5400 Series Thermal/Mechanical Design Guidelines
(TMDG) for system and environmental implementation details.
70
64.1
75
65.6
80
67.0
Table 6-8.
Quad-Core Intel® Xeon® Processor L5400 Series Thermal Specifications
Core
Frequency
Thermal Design
Power
(W)
Minimum
T
CASE
(°C)
Maximum
T
CASE
(°C)
Notes
Launch to FMB
50
5
See
Figure 6-4
;
Table 6-9
1, 2, 3, 4, 5
Table 6-7.
Quad-Core Intel® Xeon® Processor E5400 Series Thermal Profile Table
(Sheet 2 of 2)
Power (W)
T
CASE_MAX
(
°
C)
Figure 6-4. Quad-Core Intel® Xeon® Processor L5400 Series Thermal Profile
40
42
44
46
48
50
52
54
56
58
60
0
10
20
30
40
50
Power [W]
T
c
as
e [
C
]
Thermal Profile
Y = 0.298*x + 42.1
40
42
44
46
48
50
52
54
56
58
60
0
10
20
30
40
50
Power [W]
T
c
as
e [
C
]
Thermal Profile
Y = 0.298*x + 42.1
Summary of Contents for E5420 - CPU XEON QUAD CORE 2.50GHZ FSB1333MHZ 12M LGA771 HALOGEN FREE TRAY
Page 1: ...318589 005 Quad Core Intel Xeon Processor 5400 Series Datasheet August 2008 ...
Page 8: ...8 Quad Core Intel Xeon Processor 5400 Series Datasheet ...
Page 14: ...14 ...
Page 106: ...Boxed Processor Specifications 106 Figure 8 4 Top Side Board Keepout Zones Part 1 ...
Page 107: ...107 Boxed Processor Specifications Figure 8 5 Top Side Board Keepout Zones Part 2 ...
Page 108: ...Boxed Processor Specifications 108 Figure 8 6 Bottom Side Board Keepout Zones ...
Page 109: ...109 Boxed Processor Specifications Figure 8 7 Board Mounting Hole Keepout Zones ...
Page 110: ...Boxed Processor Specifications 110 Figure 8 8 Volumetric Height Keep Ins ...
