81
Thermal Specifications
power dissipation is currently planned. Intel® Thermal Monitor 1 and Intel®
Thermal Monitor 2 feature must be enabled for the processor to remain within
its specifications.
Notes:
1.
These values are specified at V
CC_MAX
for all processor frequencies. Systems must be designed to ensure
the processor is not to be subjected to any static V
CC
and I
CC
combination wherein V
CC
exceeds V
CC_MAX
at
specified I
CC
. Please refer to the loadline specifications in
Section 2.13.1
.
2.
Thermal Design Power (TDP) should be used for the processor thermal solution design targets. TDP is not
the maximum power that the processor can dissipate. TDP is measured at maximum T
CASE
.
3.
These specifications are based on silicon characterization.
4.
Power specifications are defined at all VIDs found in
Table 2-3
. The Quad-Core Intel® Xeon® Processor
X5482 may be shipped under multiple VIDs for each frequency.
5.
FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor
frequency requirements.
6.
The Quad-Core Intel® Xeon® Processor X5482 is intended for dual processor workstations only.
Notes:
1.
Please refer to
Table 6-2
for discrete points that constitute the thermal profile.
2.
Implementation of the Quad-Core Intel® Xeon® Processor X5482 Thermal Profile should result in virtually
no TCC activation. Furthermore, utilization of thermal solutions that do not meet the processor Thermal
Profile will result in increased probability of TCC activation and may incur measurable performance loss.
3.
Refer to the Quad-Core Intel® Xeon® Processor 5400 Series Thermal/Mechanical Design Guidelines
(TMDG) for system and environmental implementation details.
Table 6-1.
Quad-Core Intel® Xeon® Processor X5492 and X5482 (C-step) Thermal
Specifications
Core
Frequency
Thermal Design
Power
(W)
Minimum
T
CASE
(°C)
Maximum
T
CASE
(°C)
Notes
Launch to FMB
150 (X5492 and
X5482 C-step)
5
See
Figure 6-1
;
Table 6-2
1,2,3,4,5,6
Figure 6-1. Quad-Core Intel® Xeon® Processor X5492 and X5482 (C-step)Thermal Profile
Thermal Profile (2U)
35
40
45
50
55
60
65
70
75
0
10
20
30
40
50
60
70
80
90
100
110
120
130
140
150
Pow e r [W]
T
case
[
C
]
Thermal Profile
Y = 0.187*x + 35
Thermal Profile (2U)
35
40
45
50
55
60
65
70
75
0
10
20
30
40
50
60
70
80
90
100
110
120
130
140
150
Pow e r [W]
T
case
[
C
]
Thermal Profile
Y = 0.187*x + 35
Summary of Contents for E5420 - CPU XEON QUAD CORE 2.50GHZ FSB1333MHZ 12M LGA771 HALOGEN FREE TRAY
Page 1: ...318589 005 Quad Core Intel Xeon Processor 5400 Series Datasheet August 2008 ...
Page 8: ...8 Quad Core Intel Xeon Processor 5400 Series Datasheet ...
Page 14: ...14 ...
Page 106: ...Boxed Processor Specifications 106 Figure 8 4 Top Side Board Keepout Zones Part 1 ...
Page 107: ...107 Boxed Processor Specifications Figure 8 5 Top Side Board Keepout Zones Part 2 ...
Page 108: ...Boxed Processor Specifications 108 Figure 8 6 Bottom Side Board Keepout Zones ...
Page 109: ...109 Boxed Processor Specifications Figure 8 7 Board Mounting Hole Keepout Zones ...
Page 110: ...Boxed Processor Specifications 110 Figure 8 8 Volumetric Height Keep Ins ...
