Intel BX80619I73820, Design Manual, Page: 6 / 124

6 Thermal/Mechanical Specifications and Design Guide
Figures
1-1 Platform LGA2011-0 Socket Stack with Tall-Heat Pipe Heatsink ...................................11
2-1 Processor Package Assembly Sketch ........................................................................15
2-2 Package View .......................................................................................................16
2-3 Processor Top-Side Markings ..................................................................................18
3-1 Hexagonal Array in LGA2011-0 ...............................................................................19
3-2 Contact Wiping Direction ........................................................................................20
3-3 Schematic of LGA2011-0 Socket with Pick and Place Cover Removed ...........................20
3-4 LGA2011-0 Socket Contact Numbering (Top View of Socket).......................................21
3-5 Offset between LGA Land Center and Solder Ball Center .............................................22
3-6 LGA2011-0 Socket Land Pattern (Top View of Board) .................................................23
3-7 LGA2011-0 Pick and Place Cover .............................................................................25
3-8 Pick and Place Cover..............................................................................................25
4-1 Square ILM Part Terminology ..................................................................................28
4-2 Square ILM Assembly ............................................................................................28
4-3 ILM as Universal Retention Mechanism.....................................................................29
4-4 ILM Interlocking Feature ........................................................................................30
4-5 ILM Lever Closing Sequence ...................................................................................31
4-6 Opening ILM.........................................................................................................32
4-7 Opening Sequence for ILM and Loadplate (cont.).......................................................32
4-8 ILM Keying ...........................................................................................................33
4-9 ILM Back Plate ......................................................................................................33
4-10 Assembling Socket, Back Plate and ILM onto the Motherboard.....................................34
4-11 Optional Step: Lock down the Hinge Lever................................................................35
4-12 Pin 1 Markings on the ILM Frame.............................................................................36
4-13 Closing ILM and Loadplate......................................................................................36
4-14 ILM with Cover .....................................................................................................37
4-15 Heatsink to ILM Interface .......................................................................................38
5-1
Flow Chart of Knowledge-Based Reliability Evaluation Methodology ..............................41
6-1 TTV Thermal Profile ...............................................................................................45
6-2 Case Temperature (TCASE) Measurement Location ....................................................47
6-3 Frequency and Voltage Ordering .............................................................................49
7-1 Ping()..................................................................................................................55
7-2 Ping() Example .....................................................................................................55
7-3 GetDIB()..............................................................................................................56
7-4 Device Info Field Definition .....................................................................................56
7-5 Revision Number Definition.....................................................................................57
7-6 GetTemp() ...........................................................................................................58
7-7 GetTemp() Example ..............................................................................................58
7-8 RdPkgConfig() ......................................................................................................60
7-9 WrPkgConfig() ......................................................................................................61
7-10 DRAM Thermal Estimation Configuration Data ...........................................................64
7-11 DRAM Rank Temperature Write Data .......................................................................65
7-12 DIMM Temperature Read / Write .............................................................................65
7-13 Ambient Temperature Reference Data......................................................................66
7-14 DRAM Channel Temperature ...................................................................................66
7-15 Accumulated DRAM Energy Data .............................................................................66
7-16 DRAM Power Info Read Data...................................................................................67
7-17 DRAM Power Limit Data .........................................................................................67
7-18 DRAM Power Limit Performance Data .......................................................................68
7-19 CPUID Data ..........................................................................................................71
7-20 Platform ID Data ...................................................................................................71
7-21 Uncore Device ID ..................................................................................................72
7-22 Maximum Thread ID ..............................................................................................72
7-23 Processor Microcode Revision..................................................................................72
7-24 Package Power SKU Unit Data.................................................................................72