Quality and Reliability Requirements
108
Thermal/Mechanical Specifications and Design Guide
The following definitions apply to the use of the terms lead-free, Pb-free, and RoHS
compliant:
Halogen flame retardant free (HFR-Free) PCB
: In future revisionsof this
document, Intel will be providing guidance on the mechanical impact to using a HFR-
free laminate in the PCB.
Lead-free and Pb-free:
Lead has not been intentionally added, but lead may still
exist as an impurity below 1000 ppm.
RoHS compliant:
Lead and other materials banned in RoHS Directive are either
(1) below all applicable substance thresholds as proposed by the EU or (2) an
approved/pending exemption applies.
Note:
RoHS implementation details are not fully defined and may change.
§
Summary of Contents for BX80619I73820
Page 10: ...10 Thermal Mechanical Specifications and Design Guide...
Page 14: ...Introduction 14 Thermal Mechanical Specifications and Design Guide...
Page 104: ...Thermal Solutions 104 Thermal Mechanical Specifications and Design Guide...
Page 112: ...Mechanical Drawings 112 Thermal Mechanical Specifications and Design Guide...
Page 118: ...Socket Mechanical Drawings 118 Thermal Mechanical Specifications and Design Guide...
Page 124: ...Package Mechanical Drawings 124 Thermal Mechanical Specifications and Design Guide...
