Thermal/Mechanical Specifications and Design Guide
19
LGA2011-0 Socket
3
LGA2011-0 Socket
This chapter describes a surface mount, LGA (Land Grid Array) socket intended for the
processors in the Platform. The socket provides I/O, power and ground contacts. The
socket contains 2011 contacts arrayed about a cavity in the center of the socket with
lead-free solder balls for surface mounting on the motherboard.
The socket has 2011 contacts. The LGA2011-0 socket is introducing a hexagonal area
array ball-out which provides many benefits:
• Socket contact density increased by 12% while maintaining 40 mil minimum via
pitch requirements.
• Corresponding square pitch array’s would require a 38 mil via pitch for the same
package size.
LGA2011-0 has 1.016 mm (
40 mil)
hexagonal pitch in a 58x43 grid array with
24x16 grid depopulation in the center of the array and selective depopulation
elsewhere.
Contact wiping direction is 180 degrees as shown in
.
Figure 3-1. Hexagonal Array in LGA2011-0
Table 3-1.
LGA2011-0 Socket Attributes
LGA2011-0 Socket
Attributes
Component Size
58.5 mm(L)X51 mm (W)
Pitch
1.016 mm (Hex Array)
Ball Count
2011
40
m
il
40
m
il
40 mil
34.7 mil
40
m
il
40
m
il
40 mil
34.7 mil
40
m
il
40
m
il
40 mil
34.7 mil
Summary of Contents for BX80619I73820
Page 10: ...10 Thermal Mechanical Specifications and Design Guide...
Page 14: ...Introduction 14 Thermal Mechanical Specifications and Design Guide...
Page 104: ...Thermal Solutions 104 Thermal Mechanical Specifications and Design Guide...
Page 112: ...Mechanical Drawings 112 Thermal Mechanical Specifications and Design Guide...
Page 118: ...Socket Mechanical Drawings 118 Thermal Mechanical Specifications and Design Guide...
Page 124: ...Package Mechanical Drawings 124 Thermal Mechanical Specifications and Design Guide...
