LGA2011-0 Socket
24
Thermal/Mechanical Specifications and Design Guide
3.4
Socket Components
The socket has two main components, the socket body and Pick and Place (PnP) cover,
and is delivered as a single integral assembly. Refer to
for detailed
drawings.
3.4.1
Socket Body Housing
The housing material is thermoplastic or equivalent with UL 94 V-0 flame rating capable
of withstanding 260 °C for 40 seconds (typical reflow/rework). The socket coefficient of
thermal expansion (in the XY plane), and creep properties, must be such that the
integrity of the socket is maintained for the conditions listed in
.
The color of the housing will be dark as compared to the solder balls to provide the
contrast needed for pick and place vision systems.
3.4.2
Solder Balls
A total of 2011 solder balls corresponding to the contacts are on the bottom of the
socket for surface mounting with the motherboard.
The socket has the following solder ball material:
• Lead free SAC305(SnAgCu) solder alloy with a silver (Ag) content 3%, copper (Cu)
0.5%,tin (Sn) 96.5% and a melting temperature of approximately 217 °C. The
immersion silver (ImAg) motherboard surface finish and solder paste alloy must be
compatible with the SAC alloy solder paste.
The co-planarity (profile) and true position requirements are defined in
3.4.3
Contacts
The base material for the contacts is high strength copper alloy.
For the area on socket contacts where processor lands will mate, there is a 0.381
μ
m
[15
μ
inches] minimum gold plating over 1.27
μ
m [50
μ
inches] minimum nickel
underplate.
No contamination by solder in the contact area is allowed during solder reflow.
3.4.4
Pick and Place Cover
The cover provides a planar surface for vacuum pick up used to place components in
the Surface Mount Technology (SMT) manufacturing line. The cover remains on the
socket during reflow to help prevent contamination during reflow. The cover can
withstand 260 °C for 40 seconds (typical reflow/rework profile) and the conditions
listed in
without degrading.
Summary of Contents for BX80619I73820
Page 10: ...10 Thermal Mechanical Specifications and Design Guide...
Page 14: ...Introduction 14 Thermal Mechanical Specifications and Design Guide...
Page 104: ...Thermal Solutions 104 Thermal Mechanical Specifications and Design Guide...
Page 112: ...Mechanical Drawings 112 Thermal Mechanical Specifications and Design Guide...
Page 118: ...Socket Mechanical Drawings 118 Thermal Mechanical Specifications and Design Guide...
Page 124: ...Package Mechanical Drawings 124 Thermal Mechanical Specifications and Design Guide...