Mechanical Drawings
110
Thermal/Mechanical Specifications and Design Guide
Figure A-1. Board Keepin / Keepout Zones (Sheet 1 of 2)
8 7 6 5 4 3
2
H
G
F
E
D
C
B
A
8 7 6 5 4 3
2 1
H
G
F
E
D
C
B
A
R
52.00
0.00
39.45
2X 23.00
2X 23.00
39.45
42.00
52.00
52.00
0.00
45.00
9.70
9.70
R2.50
2X 34.57
2X 34.57
42.00
2X 8
49.99
2X 8
40.52
2X 8
40.52
2X 8
49.99
2X 23.00
2X 23.00
2X 34.60
2X 34.60
38.38
2X 8
49.99
2X 8
40.52
2X 8
40.52
2X 8
49.99
45.00
30.99
38.38
17.00
48.20
30.99
40.00
40.00
40.00
40.00
4X
(NO ROUTING)
6.50
4X
LOCATION 0.1 RADIAL TRUE POSITION RELATIVE TO SOCKET CENTER
4.50
+0.05 -0.03
4X
(NO ROUTING)
6.50
R
TYP
5.0
17.00
2X 34.18
2X 34.18
48.20
43.00
43.00
26.58
14.45
26.58
15.53
2X 25.57
2X 25.57
4X
NPTH
LOCATION 0.1 RADIAL TRUE POSITION RELATIVE TO SOCKET CENTER.
3.80
+0.05 -0.03
(104.00)
(104.00)
(46.00)
(69.20)
(
)
7.00
(
)
7.00
(80.00)
(80.00)
REVISION HISTORY
ZONE
REV
DESCRIPTION
DATE
APPROVED
-
1.2
RELEASED
Jan-08-10
T.Ault
C-4
1.3
4.50 HOLE AND
6.50 RKO CHANGED FROM
4.03 AND
5.50 TO MATCH BOARD LAYOUT.
JAN-22-10
T.AULT
SHT 2
1.4
BACK SIDE KOZ CHANGED TO 72X82 (WAS 59X82)
MAY-17-10
K.KOZYRA
E76352
1
1.4
DWG. NO
SHT.
REV
DEPARTMENT
2200 MISSION COLLEGE BLVD. P.O. BOX 58119 SANTA CLARA, CA 95052-8119
CMTE
TITLE
LGA 2011 SOCKET ATX KEEP-INS
SIZE
DRAWING NUMBER
REV
A1
E76352
1.4
SCALE: NONE
DO NOT SCALE DRAWING
SHEET 1 OF 2
N.A.
N.A.
FINISH
MATERIAL
DATE
APPROVED BY
-
DATE
CHECKED BY
DATE
DRAWN BY
DATE
DESIGNED BY
UNLESS OTHERWISE SPECIFIED
INTERPRET DIMENSIONS AND TOLERANCES IN ACCORDANCE WITH ASME Y14.5M-1994
DIMENSIONS ARE IN MILLIMETERS
ALL UNTOLERANCED LINEAR
DIMENSIONS ±0.3
ANGLES ±0.5
THIRD ANGLE PROJECTION
PARTS LIST
DESCRIPTION
PART NUMBER
ITEM NO
QTY
E76352
TOP
NOTES: 1. DIMENSIONS ARE IN MILLIMETERS.
2
GEOMETRIC CENTER OF CPU PACKAGE / SOCKET HOUSING CAVITY.
3. BOARD COMPONENT KEEP-INS AND MECHANICAL COMPONENT KEEP-OUTS TO BE UTILIZED WITH SUFFICIENT ALLOWANCES FOR PLACEMENT AND SIZE TOLERANCES, ASSEMBLY PROCESS ACCESS, AND DYNAMIC EXCURSIONS. 4. ASSUME SYMMETRY FOR UNDIMENSIONED CORNERS AND EDGES. 5 REMOVED
6
NON-GROUNDED COPPER SURFACE ADDED TO INCREASE PCB DURABILITY.
7
COMBINED COMPONENT AND SOLDER PASTE HEIGHT INCLUDING TOLERANCES AFTER REFLOW.
8
REFERENCE TO THEORETICAL INTERSECTION.
BOARD PRIMARY SIDE
2
2
PACKAGE BOUNDARY
PIN 1
REFERENCE
SOCKET BOUNDARY
ROUTING KEEP-OUTS
COMPONENT VOLUMETRIC KEEP-INS
LEGEND
SOCKET/THERMO/MECHANICAL COMPONENT KEEP-INS
10.0MM MAX COMPONENT HEIGHT
7
ROUTING AND COMPONENT KEEP-OUT
1.5 MM MAX COMPONENT HEIGHT
7
2.54 MM MAX COMPONENT HEIGHT
7
Summary of Contents for BX80619I73820
Page 10: ...10 Thermal Mechanical Specifications and Design Guide...
Page 14: ...Introduction 14 Thermal Mechanical Specifications and Design Guide...
Page 104: ...Thermal Solutions 104 Thermal Mechanical Specifications and Design Guide...
Page 112: ...Mechanical Drawings 112 Thermal Mechanical Specifications and Design Guide...
Page 118: ...Socket Mechanical Drawings 118 Thermal Mechanical Specifications and Design Guide...
Page 124: ...Package Mechanical Drawings 124 Thermal Mechanical Specifications and Design Guide...