Thermal/Mechanical Specifications and Design Guide
27
Independent Loading Mechanism (ILM)
4
Independent Loading
Mechanism (ILM)
The Independent Loading Mechanism (ILM) provides the force needed to seat the
2011-land LGA package onto the socket contacts. The ILM is physically separate from
the socket body. The assembly of the ILM is expected to occur after attaching the
socket to the board. The exact assembly location is dependent on manufacturing
preference and test flow.
The mechanical design of the ILM is a key contributor to the overall functionality of the
LGA2011-0 socket. Intel performs detailed studies on integration of processor package,
socket and ILM as a system. These studies directly impact the design of the ILM. The
Intel reference ILM will be “built to print” from Intel controlled drawings. Intel
recommends using the Intel Reference ILM. Custom non-Intel ILM designs do not
benefit from Intel's detailed studies and may not incorporate critical design
parameters.
Note:
The ILM has two critical functions: deliver the force to seat the processor onto the
socket contacts and distribute the resulting load evenly through the socket solder
joints. Another purpose of ILM is to ensure electrical integrity/performance of the
socket and package.
Note:
This design will be “built to print” from Intel controlled drawings.
Summary of Contents for BX80619I73820
Page 10: ...10 Thermal Mechanical Specifications and Design Guide...
Page 14: ...Introduction 14 Thermal Mechanical Specifications and Design Guide...
Page 104: ...Thermal Solutions 104 Thermal Mechanical Specifications and Design Guide...
Page 112: ...Mechanical Drawings 112 Thermal Mechanical Specifications and Design Guide...
Page 118: ...Socket Mechanical Drawings 118 Thermal Mechanical Specifications and Design Guide...
Page 124: ...Package Mechanical Drawings 124 Thermal Mechanical Specifications and Design Guide...
